|
70N06L-TQ2-R |
70N06 |
70N06G-TQ2-T |
70N06G-TA3-T |
70N06L-TQ2-T |
70N06L-TA3-T |
70N06G-T2Q-T |
70N06_09 |
70N06G-TQ2-R |
70N06L-T2Q-T |
Description |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
70 Amps, 60 Volts N-CHANNEL POWER MOSFET |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
conform to |
conform to |
conform to |
- |
conform to |
conform to |
Parts packaging code |
D2PAK |
- |
D2PAK |
TO-220AB |
D2PAK |
TO-220AB |
TO-262AA |
- |
D2PAK |
TO-262AA |
package instruction |
SMALL OUTLINE, R-PSSO-G2 |
- |
SMALL OUTLINE, R-PSSO-G2 |
FLANGE MOUNT, R-PSFM-T3 |
SMALL OUTLINE, R-PSSO-G2 |
FLANGE MOUNT, R-PSFM-T3 |
IN-LINE, R-PSIP-T3 |
- |
SMALL OUTLINE, R-PSSO-G2 |
IN-LINE, R-PSIP-T3 |
Contacts |
4 |
- |
4 |
3 |
4 |
3 |
3 |
- |
4 |
3 |
Reach Compliance Code |
compli |
- |
compli |
compli |
compli |
compli |
compli |
- |
compli |
compli |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
600 mJ |
- |
600 mJ |
600 mJ |
600 mJ |
600 mJ |
600 mJ |
- |
600 mJ |
600 mJ |
Configuration |
SINGLE WITH BUILT-IN DIODE |
- |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
- |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
60 V |
- |
60 V |
60 V |
60 V |
60 V |
60 V |
- |
60 V |
60 V |
Maximum drain current (ID) |
70 A |
- |
70 A |
70 A |
70 A |
70 A |
70 A |
- |
70 A |
70 A |
Maximum drain-source on-resistance |
0.015 Ω |
- |
0.015 Ω |
0.015 Ω |
0.015 Ω |
0.015 Ω |
0.015 Ω |
- |
0.015 Ω |
0.015 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
- |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
- |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code |
TO-263AB |
- |
TO-263AB |
TO-220AB |
TO-263AB |
TO-220AB |
TO-262AA |
- |
TO-263AB |
TO-262AA |
JESD-30 code |
R-PSSO-G2 |
- |
R-PSSO-G2 |
R-PSFM-T3 |
R-PSSO-G2 |
R-PSFM-T3 |
R-PSIP-T3 |
- |
R-PSSO-G2 |
R-PSIP-T3 |
Number of components |
1 |
- |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
Number of terminals |
2 |
- |
2 |
3 |
2 |
3 |
3 |
- |
2 |
3 |
Operating mode |
ENHANCEMENT MODE |
- |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
- |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
- |
SMALL OUTLINE |
FLANGE MOUNT |
SMALL OUTLINE |
FLANGE MOUNT |
IN-LINE |
- |
SMALL OUTLINE |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
N-CHANNEL |
- |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
- |
N-CHANNEL |
N-CHANNEL |
Maximum pulsed drain current (IDM) |
280 A |
- |
280 A |
280 A |
280 A |
280 A |
280 A |
- |
280 A |
280 A |
surface mount |
YES |
- |
YES |
NO |
YES |
NO |
NO |
- |
YES |
NO |
Terminal form |
GULL WING |
- |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
- |
GULL WING |
THROUGH-HOLE |
Terminal location |
SINGLE |
- |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
- |
SINGLE |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
- |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
- |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
- |
SILICON |
SILICON |
SILICON |
SILICON |
SILICON |
- |
SILICON |
SILICON |
Maker |
- |
- |
UNISONIC TECHNOLOGIES CO.,LTD |
UNISONIC TECHNOLOGIES CO.,LTD |
UNISONIC TECHNOLOGIES CO.,LTD |
UNISONIC TECHNOLOGIES CO.,LTD |
- |
- |
UNISONIC TECHNOLOGIES CO.,LTD |
UNISONIC TECHNOLOGIES CO.,LTD |