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HIP2500IP

Description
Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP14
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size548KB,9 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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HIP2500IP Overview

Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP14

HIP2500IP Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
high side driverYES
Interface integrated circuit typeHALF BRIDGE BASED MOSFET DRIVER
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Number of functions1
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output peak current2.3 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Disconnect time0.725 µs
connection time0.625 µs

HIP2500IP Related Products

HIP2500IP HIP2500IP1 HIP2500IB
Description Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP14 Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP16 Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDSO16
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
high side driver YES YES YES
Interface integrated circuit type HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code R-PDIP-T14 R-PDIP-T16 R-PDSO-G16
JESD-609 code e0 e0 e0
Number of functions 1 1 1
Number of terminals 14 16 16
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Nominal output peak current 2.3 A 2.3 A 2.3 A
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Disconnect time 0.725 µs 0.725 µs 0.725 µs
connection time 0.625 µs 0.625 µs 0.625 µs
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