HIP2500IP1 datasheet, PDF - EEWORLD Datasheet

HIP2500IP1: DescriptionHalf Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP16; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size548KB，9 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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HIP2500IP1 Overview

Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP16

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
high side driver	YES
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output peak current	2.3 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Disconnect time	0.725 µs
connection time	0.625 µs

	HIP2500IP1	HIP2500IP	HIP2500IB
Description	Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP16	Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP14	Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDSO16
Is it lead-free?	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
high side driver	YES	YES	YES
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDIP-T16	R-PDIP-T14	R-PDSO-G16
JESD-609 code	e0	e0	e0
Number of functions	1	1	1
Number of terminals	16	14	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Nominal output peak current	2.3 A	2.3 A	2.3 A
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Disconnect time	0.725 µs	0.725 µs	0.725 µs
connection time	0.625 µs	0.625 µs	0.625 µs

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