|
HIP2500IB |
HIP2500IP |
HIP2500IP1 |
Description |
Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDSO16 |
Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP14 |
Half Bridge Based MOSFET Driver, 2.3A, CMOS, PDIP16 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Maker |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Reach Compliance Code |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
high side driver |
YES |
YES |
YES |
Interface integrated circuit type |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 code |
R-PDSO-G16 |
R-PDIP-T14 |
R-PDIP-T16 |
JESD-609 code |
e0 |
e0 |
e0 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
16 |
14 |
16 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Nominal output peak current |
2.3 A |
2.3 A |
2.3 A |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
YES |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Disconnect time |
0.725 µs |
0.725 µs |
0.725 µs |
connection time |
0.625 µs |
0.625 µs |
0.625 µs |