|
74HCT27BQ |
74HC27 |
74HC27BQ |
74HC27N |
74HCT27 |
74HCT27D |
74HCT27N |
Description |
Triple 3-input NOR gate |
Triple 3-input NOR gate |
Triple 3-input NOR gate |
Triple 3-input NOR gate |
8-Bit Parallel-Out Serial Shift Registers 14-SOIC -40 to 85 |
Triple 3-input NOR gate |
Triple 3-input NOR gate |
Is it lead-free? |
Contains lead |
- |
Contains lead |
Lead free |
- |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
- |
conform to |
conform to |
Maker |
NXP |
- |
NXP |
NXP |
- |
NXP |
NXP |
Parts packaging code |
QFN |
- |
QFN |
DIP |
- |
SOIC |
DIP |
package instruction |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
- |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
DIP, DIP14,.3 |
- |
SOT-108-1, SO-14 |
DIP, DIP14,.3 |
Contacts |
14 |
- |
14 |
14 |
- |
14 |
14 |
Reach Compliance Code |
compli |
- |
compli |
unknow |
- |
unknow |
unknow |
series |
HCT |
- |
HC/UH |
HC/UH |
- |
HCT |
HCT |
JESD-30 code |
R-PQCC-N14 |
- |
R-PQCC-N14 |
R-PDIP-T14 |
- |
R-PDSO-G14 |
R-PDIP-T14 |
length |
3 mm |
- |
3 mm |
19.025 mm |
- |
8.65 mm |
19.025 mm |
Load capacitance (CL) |
50 pF |
- |
50 pF |
50 pF |
- |
50 pF |
50 pF |
Logic integrated circuit type |
NOR GATE |
- |
NOR GATE |
NOR GATE |
- |
NOR GATE |
NOR GATE |
MaximumI(ol) |
0.004 A |
- |
0.004 A |
0.004 A |
- |
0.004 A |
0.004 A |
Number of functions |
3 |
- |
3 |
3 |
- |
3 |
3 |
Number of entries |
3 |
- |
3 |
3 |
- |
3 |
3 |
Number of terminals |
14 |
- |
14 |
14 |
- |
14 |
14 |
Maximum operating temperature |
125 °C |
- |
125 °C |
125 °C |
- |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
- |
HVQCCN |
DIP |
- |
SOP |
DIP |
Encapsulate equivalent code |
LCC14,.1X.12,20 |
- |
LCC14,.1X.12,20 |
DIP14,.3 |
- |
SOP14,.25 |
DIP14,.3 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
- |
SMALL OUTLINE |
IN-LINE |
power supply |
5 V |
- |
2/6 V |
2/6 V |
- |
5 V |
5 V |
Prop。Delay @ Nom-Su |
26 ns |
- |
23 ns |
23 ns |
- |
26 ns |
26 ns |
propagation delay (tpd) |
32 ns |
- |
135 ns |
27 ns |
- |
32 ns |
32 ns |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
- |
NO |
NO |
- |
NO |
NO |
Maximum seat height |
1 mm |
- |
1 mm |
4.2 mm |
- |
1.75 mm |
4.2 mm |
Maximum supply voltage (Vsup) |
5.5 V |
- |
6 V |
6 V |
- |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
- |
2 V |
2 V |
- |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
5 V |
- |
5 V |
5 V |
surface mount |
YES |
- |
YES |
NO |
- |
YES |
NO |
technology |
CMOS |
- |
CMOS |
CMOS |
- |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
Terminal form |
NO LEAD |
- |
NO LEAD |
THROUGH-HOLE |
- |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
0.5 mm |
- |
0.5 mm |
2.54 mm |
- |
1.27 mm |
2.54 mm |
Terminal location |
QUAD |
- |
QUAD |
DUAL |
- |
DUAL |
DUAL |
width |
2.5 mm |
- |
2.5 mm |
7.62 mm |
- |
3.9 mm |
7.62 mm |
Base Number Matches |
1 |
- |
1 |
1 |
- |
1 |
1 |