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From the manufacturing process to all application areas, ultra-low power technology has gradually become an indispensable requirement in all designs. Energy-sensitive applications, especially products...[Details]
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BYD announced that the application for spin-off listing on the Growth Enterprise Market of BYD Semiconductor Co., Ltd. (hereinafter referred to as BYD Semiconductor) has been accepted by the Shenzhen...[Details]
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1. Background description
Users in a certain area reported that the air conditioner did not work when the F4 display was displayed. The fault persisted after power off and then on again. As we...[Details]
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Blank situation, this word is the most appropriate to describe the field of domestic automotive-grade chips. This blank situation once hindered the speed of transformation of many Chinese local enter...[Details]
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The Industrial Internet of Things (IIoT) is the foundation of Industry 4.0. By sending sensor data to the cloud and leveraging machine learning algorithms, manufacturers can detect problems in indust...[Details]
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Abstract: This design is a dormitory intelligent fire and theft alarm system based on the ARM Cortex-M3 processor core LM3S1138 as the main controller. The system can determine whether there is a fir...[Details]
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Corning Expands High-Refractive-Index Glass Portfolio to Advance Augmented Reality (AR) Adoption
2.0 High Refractive Index Glass Helps AR Wearable Devices Present Larger and Clearer ...[Details]
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The Portable Digital Data Acquisition System (PDDAS) uses LabVIEW Real-Time and PXI to control the wind tunnel test and record air pressure data from 128 different channels.
"The LabVIEW Real-...[Details]
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As a person with a bad memory, it is a tragedy to always forget the key. I have been locked out several times, and waiting is a painful thing. I decided to change. I will not forget my finge...[Details]
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According to Jiwei.com, on October 27, Changdian Technology announced its third-quarter financial report, achieving revenue of RMB 8.099 billion, a year-on-year increase of 19.32%; net profit attribu...[Details]
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According to Nikkei Asian Review, TSMC is working with American technology giants such as Google to develop new chip packaging technology. As Moore's Law slows and shrinking the space between transi...[Details]
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Infineon Technologies AG's power device online simulation platform IPOSIM is widely used to
calculate the losses and thermal performance of power modules, discrete devices and flat devices
...[Details]
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USB-IF launched the USB3.0 specification in November 2008. The technology was jointly developed by the USB3.0 promotion group composed of Intel, Microsoft, HP, NEC, NXP Semiconductors, TI a...[Details]
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Recently, Shandong issued the "Guiding Opinions on Provincial Energy Work in 2023", proposing to take the lead in accelerating the exploration of large-scale development of offshore photovoltaics a...[Details]
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Developers can use the Configurable Logic Block (CLB) peripheral in the PIC16F13145 family of microcontrollers to implement complex discrete logic functions in hardware, thereby reducing the bill...[Details]
Power technology
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