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MAX13102EEWX+

Description
16-Channel Buffered CMOS Logic-Level Translators
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size229KB,18 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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MAX13102EEWX+ Overview

16-Channel Buffered CMOS Logic-Level Translators

MAX13102EEWX+ Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMaxim
package instructionFBGA, BGA36,6X6,20
Reach Compliance Codecompli
Interface integrated circuit typeTELEPHONE RELAY DRIVER
JESD-30 codeS-PBGA-B36
Number of terminals36
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA36,6X6,20
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
power supply1.2/5,1.8/5 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
MAX13101E/MAX13102E/
MAX13103E/MAX13108E
16-Channel Buffered CMOS
Logic-Level Translators
General Description
The MAX13101E/MAX13102E/MAX13103E/MAX13108E
16-bit bidirectional CMOS logic-level translators pro-
vide the level shifting necessary to allow data transfer in
multivoltage systems. These devices are inherently
bidirectional due to their design and do not require the
use of a direction input. Externally applied voltages,
V
CC
and V
L
, set the logic levels on either side of the
devices. Logic signals present on the V
L
side of the
device appear as a higher voltage logic signal on the
V
CC
side of the device, and vice-versa.
The MAX13101E/MAX13102E/MAX13103E feature an
enable input (EN) that, when low, reduces the V
CC
and
V
L
supply currents to less than 2µA. The MAX13108E
features a multiplexing input (MULT) that selects one
byte between the two, thus allowing multiplexing of the
signals. The MAX13101E/MAX13102E/MAX13103E/
MAX13108E have ±15kV ESD protection on the I/O V
CC
side for greater protection in applications that route sig-
nals externally. Three different output configurations are
available during shutdown, allowing the I/O on the V
CC
side or the V
L
side to be put in a high-impedance state
or pulled to ground through an internal 6kΩ resistor.
The MAX13101E/MAX13102E/MAX13103E/MAX13108E
accept V
CC
voltages from +1.65V to +5.5V and V
L
voltages from +1.2V to V
CC
, making them ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems. The MAX13101E/MAX13102E/
MAX13103E/MAX13108E are available in 36-bump
WLP and 40-pin TQFN packages, and operate over the
extended -40°C to +85°C temperature range. See the
Ordering Information.
Features
o
Wide Supply Voltage Range
V
CC
Range of 1.65V to 5.5V
V
L
Range of 1.2V to V
CC
o
ESD Protection on I/O V
CC
Lines
±15kV Human Body Model
o
Up to 20Mbps Throughput
o
Low 0.03µA Typical Quiescent Current
o
WLP and TQFN Packages
Pin Configurations
TOP VIEW OF BOTTOM LEADS
I/O V
CC
10
I/O V
CC
11
I/O V
CC
7
I/O V
CC
12
22
I/O V
CC
5
I/O V
CC
6
I/O V
CC
8
I/O V
CC
9
GND
GND
21
20 I/O V
CC
13
19 I/O V
CC
14
18 I/O V
CC
15
17 I/O V
CC
16
MAX13101E
MAX13102E
MAX13103E
16 V
CC
15 V
L
14 I/O V
L
16
*EP
13 I/O V
L
15
12 I/O V
L
14
11 I/O V
L
13
2
I/O V
L
5
3
I/O V
L
6
4
I/O V
L
7
5
I/O V
L
8
6
I/O V
L
9
7
I/O V
L
10
8
I/O V
L
11
9
I/O V
L
12
10
EN
30
I/O V
CC
4
I/O V
CC
3
I/O V
CC
2
I/O V
CC
1
V
CC
V
L
I/O V
L
1
I/O V
L
2
I/O V
L
3
I/O V
L
4
31
32
33
34
35
36
37
38
39
40
29
28
27
26
25
24
23
+
1
GND
Applications
CMOS Logic-Level
Translation
Portable Equipment
Cell Phones
PDAs
Digital Still Cameras
Smart Phones
*EXPOSED PAD CONNECTED TO GROUND
TQFN
Pin Configurations continued at end of data sheet.
Typical Operating Circuit appears at end of data sheet.
Ordering Information/Selector Guide
PART
MAX13101EETL+
PIN-PACKAGE
40 TQFN-EP*
5mm x 5mm x 0.8mm
DATA
RATE (Mbps)
20
I/O V
L
STATE
DURING SHUTDOWN
High impedance
I/O V
CC
STATE
DURING SHUTDOWN
6kΩ to GND
MULTIPLEXER
FEATURE
No
Note:
All devices are specified over the -40°C to +85°C operating temperature range.
+Denotes
a lead-free/RoHS-compliant package.
*EP
= Exposed pad.
Ordering Information/Selector Guide continued at end of data sheet.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-3802; Rev 4; 7/13

MAX13102EEWX+ Related Products

MAX13102EEWX+ MAX13101E MAX13102E MAX13103E MAX13108E MAX13101EETL+ MAX13101EEWX+ MAX13103EEWX+ MAX13108EEWX+ MAX13108EETL+
Description 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators 16-Channel Buffered CMOS Logic-Level Translators
Is it Rohs certified? conform to - - - - conform to conform to conform to conform to conform to
Maker Maxim - - - - Maxim Maxim Maxim Maxim Maxim
package instruction FBGA, BGA36,6X6,20 - - - - HVQCCN, LCC40,.2SQ,16 VFBGA, BGA36,6X6,20 FBGA, BGA36,6X6,20 FBGA, BGA36,6X6,20 HVQCCN, LCC40,.2SQ,16
Reach Compliance Code compli - - - - compli compli compli compli compli
Interface integrated circuit type TELEPHONE RELAY DRIVER - - - - TELEPHONE RELAY DRIVER TELEPHONE RELAY DRIVER TELEPHONE RELAY DRIVER TELEPHONE RELAY DRIVER TELEPHONE RELAY DRIVER
JESD-30 code S-PBGA-B36 - - - - S-XQCC-N40 S-PBGA-B36 S-PBGA-B36 S-PBGA-B36 S-XQCC-N40
Number of terminals 36 - - - - 40 36 36 36 40
Maximum operating temperature 85 °C - - - - 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - - - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - - - - UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code FBGA - - - - HVQCCN VFBGA FBGA FBGA HVQCCN
Encapsulate equivalent code BGA36,6X6,20 - - - - LCC40,.2SQ,16 BGA36,6X6,20 BGA36,6X6,20 BGA36,6X6,20 LCC40,.2SQ,16
Package shape SQUARE - - - - SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH - - - - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
power supply 1.2/5,1.8/5 V - - - - 1.2/5,1.8/5 V 1.2/5,1.8/5 V 1.2/5,1.8/5 V 1.2/5,1.8/5 V 1.2/5,1.8/5 V
Certification status Not Qualified - - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES - - - - YES YES YES YES YES
technology CMOS - - - - BICMOS BICMOS CMOS CMOS BICMOS
Temperature level INDUSTRIAL - - - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL - - - - NO LEAD BALL BALL BALL NO LEAD
Terminal pitch 0.5 mm - - - - 0.4 mm 0.5 mm 0.5 mm 0.5 mm 0.4 mm
Terminal location BOTTOM - - - - QUAD BOTTOM BOTTOM BOTTOM QUAD

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