MBM27C64-25CV datasheet, PDF - EEWORLD Datasheet

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MBM27C64-25CV: DescriptionEPROM, 8KX8, 250ns, CMOS, CQCC32,; Categorystorage storage; File Size582KB，11 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MBM27C64-25CV Overview

EPROM, 8KX8, 250ns, CMOS, CQCC32,

MBM27C64-25CV Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFJ
package instruction	QCCN, LCC32,.45X.55
Contacts	32
Reach Compliance Code	compliant
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-XQCC-N32
JESD-609 code	e0
memory density	65536 bit
memory width	8
Number of terminals	32
word count	8192 words
character code	8000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5 V
Programming voltage	21 V
Certification status	Not Qualified
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

MBM27C64-25CV Related Products

	MBM27C64-25CV	MBM27C64-30Z	MBM27C64-20CV	MBM27C64-30Z-W	MBM27C64-25Z	MBM27C64-25Z-X
Description	EPROM, 8KX8, 250ns, CMOS, CQCC32,	EPROM, 8KX8, 300ns, CMOS, CDIP28,	EPROM, 8KX8, 200ns, CMOS, CQCC32,	EPROM, 8KX8, 300ns, CMOS, CDIP28,	EPROM, 8KX8, 250ns, CMOS, CDIP28,	IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCN, LCC32,.45X.55	DIP, DIP28,.6	QCCN, LCC32,.45X.55	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	250 ns	300 ns	200 ns	300 ns	250 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XQCC-N32	R-XDIP-T28	R-XQCC-N32	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
memory width	8	8	8	8	8	8
Number of terminals	32	28	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	70 °C	85 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	DIP	QCCN	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Programming voltage	21 V	21 V	21 V	21 V	21 V	21 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
Parts packaging code	QFJ	DIP	QFJ	-	DIP	-
Contacts	32	28	32	-	28	-
power supply	5 V	5 V	5 V	5 V	5 V	-
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	-	0.0001 A	-
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	-	0.03 mA	0.03 mA
Maker	-	FUJITSU	FUJITSU	FUJITSU	FUJITSU	-

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