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MBM27C64-25Z

Description
EPROM, 8KX8, 250ns, CMOS, CDIP28,
Categorystorage    storage   
File Size582KB,11 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MBM27C64-25Z Overview

EPROM, 8KX8, 250ns, CMOS, CDIP28,

MBM27C64-25Z Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFUJITSU
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codecompliant
Maximum access time250 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T28
JESD-609 codee0
memory density65536 bit
memory width8
Number of terminals28
word count8192 words
character code8000
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Programming voltage21 V
Certification statusNot Qualified
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MBM27C64-25Z Related Products

MBM27C64-25Z MBM27C64-25CV MBM27C64-30Z MBM27C64-20CV MBM27C64-30Z-W MBM27C64-25Z-X
Description EPROM, 8KX8, 250ns, CMOS, CDIP28, EPROM, 8KX8, 250ns, CMOS, CQCC32, EPROM, 8KX8, 300ns, CMOS, CDIP28, EPROM, 8KX8, 200ns, CMOS, CQCC32, EPROM, 8KX8, 300ns, CMOS, CDIP28, IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6 QCCN, LCC32,.45X.55 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code compliant compliant compliant compliant compliant compliant
Maximum access time 250 ns 250 ns 300 ns 200 ns 300 ns 250 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T28 R-XQCC-N32 R-XDIP-T28 R-XQCC-N32 R-XDIP-T28 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
memory width 8 8 8 8 8 8
Number of terminals 28 32 28 32 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 125 °C 85 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN DIP QCCN DIP DIP
Encapsulate equivalent code DIP28,.6 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE
Programming voltage 21 V 21 V 21 V 21 V 21 V 21 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL QUAD DUAL QUAD DUAL DUAL
Maker FUJITSU - FUJITSU FUJITSU FUJITSU -
Parts packaging code DIP QFJ DIP QFJ - -
Contacts 28 32 28 32 - -
power supply 5 V 5 V 5 V 5 V 5 V -
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A - -
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA - 0.03 mA

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