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AS9C25512M2018L-250BI

Description
Dual-Port SRAM, 512KX18, 6.5ns, CMOS, PBGA256, BGA-256
Categorystorage    storage   
File Size1MB,30 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Download Datasheet Parametric View All

AS9C25512M2018L-250BI Overview

Dual-Port SRAM, 512KX18, 6.5ns, CMOS, PBGA256, BGA-256

AS9C25512M2018L-250BI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeBGA
package instructionLBGA,
Contacts256
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time6.5 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
memory density9437184 bit
Memory IC TypeDUAL-PORT SRAM
memory width18
Number of functions1
Number of terminals256
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)2.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
Base Number Matches1
September 2004
Preliminary Information
®
AS9C25512M2018L
AS9C25256M2018L
2.5V 512/256K X 18 Synchronous Dual-port SRAM with 3.3V or 2.5V interface
Features
• True Dual-Port memory cells that allow simulta-
neous access of the same memory location
• Organisation: 524,288/262,144 × 18
[1]
• Fully Synchronous, independent operation on
both ports
• Selectable Pipeline or Flow-Through output
mode
• Fast clock speeds in Pipeline output mode: 250
MHz operation (9Gbps bandwidth)
• Fast clock to data access: 2.8ns for Pipeline out-
put mode
• Asynchronous output enable control
• Fast OE access times: 2.8ns
• Double Cycle Deselect (DCD) for Pipeline Out-
put Mode
• 19/18
[1]
-bit counter with Increment, Hold and
Repeat features on each port
Note:
1. AS9C25512M2018L/AS9C25256M2018L
Dual Chip enables on both ports for easy
depth expansion
Interrupt and Collision Detection Features
2.5 V power supply for the core
LVTTL compatible, selectable 3.3V or
2.5V power supply for I/Os, addresses,
clock and control signals on each port
Snooze modes for each port for standby
operation
15mA typical standby current in power
down mode
Available in 256-pin Ball Grid Array
(BGA), 144-pin Thin Quad Flatpack
(TQFP) and 208-pin fine pitch Ball Grid
Array (fpBGA)
Supports JTAG features compliant with
IEEE 1149.1
Selection guide
Feature
Minimum cycle time
Maximum Pipeline clock frequency
Maximum Pipeline clock access time
Maximum flow-through clock frequency
Maximum flow-through clock access time
Maximum operating current
Maximum snooze mode current
-250
4
250
2.8
150
6.5
TBD
18
-200
5
200
3.4
133
7.5
350
18
-166
6
166
3.6
100
10
300
18
-133
7.5
133
4.2
83
12
260
18
Units
ns
MHz
ns
MHz
ns
mA
mA
9/24/04; v.1.2
Alliance Semiconductor
P. 1 of 30
Copyright © Alliance Semiconductor. All rights reserved.
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