MR2A08AMA35 datasheet, PDF - EEWORLD Datasheet

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MR2A08AMA35: DescriptionMemory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48; Categorystorage storage; File Size996KB，15 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR2A08AMA35 Overview

Memory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48

MR2A08AMA35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	LFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	2097152 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	N/A
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.35 mm
Maximum standby current	0.02 A
Maximum slew rate	0.135 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm
Base Number Matches	1

MR2A08AMA35 Related Products

	MR2A08AMA35	MR2A08AYS35	MR2A08ACMA35	MR2A08AMA35R	MR2A08AMYS35R	MR2A08AMYS35	MR2A08ACYS35R	MR2A08ACMA35R
Description	Memory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 512KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	TSOP2	BGA	BGA	TSOP2	TSOP2	TSOP2	BGA
package instruction	LFBGA, BGA48,6X8,30	TSOP2, TSOP44,.46,32	LFBGA, BGA48,6X8,30	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	LFBGA,
Contacts	48	44	48	48	44	44	44	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-PBGA-B48	R-PDSO-G44	S-PBGA-B48	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48
length	8 mm	18.41 mm	8 mm	8 mm	18.41 mm	18.41 mm	18.41 mm	8 mm
memory density	2097152 bit	4194304 bit	2097152 bit	4194304 bit	2097152 bit	2097152 bit	2097152 bit	4194304 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	48	44	48	48	44	44	44	48
word count	262144 words	524288 words	262144 words	524288 words	262144 words	262144 words	262144 words	524288 words
character code	256000	512000	256000	512000	256000	256000	256000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX8	512KX8	256KX8	512KX8	256KX8	256KX8	256KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	TSOP2	LFBGA	LFBGA	TSOP2	TSOP2	TSOP2	LFBGA
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260
Maximum seat height	1.35 mm	1.2 mm	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm	1.35 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	0.75 mm	0.8 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm	0.75 mm
Terminal location	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40
width	8 mm	10.16 mm	8 mm	8 mm	10.16 mm	10.16 mm	10.16 mm	8 mm
Maximum access time	35 ns	35 ns	35 ns	-	35 ns	35 ns	35 ns	-
Mixed memory types	N/A	N/A	N/A	-	N/A	N/A	N/A	-
Encapsulate equivalent code	BGA48,6X8,30	TSOP44,.46,32	BGA48,6X8,30	-	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	-
power supply	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
Maximum standby current	0.02 A	0.02 A	0.02 A	-	0.02 A	0.02 A	0.02 A	-
Maximum slew rate	0.135 mA	0.135 mA	0.135 mA	-	0.135 mA	0.135 mA	0.135 mA	-

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