MR2A08ACMA35R datasheet, PDF - EEWORLD Datasheet

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MR2A08ACMA35R: DescriptionMemory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48; Categorystorage storage; File Size996KB，15 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR2A08ACMA35R Overview

Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48

MR2A08ACMA35R Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	48
Reach Compliance Code	compli
ECCN code	EAR99
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	4194304 bi
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.35 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm

MR2A08ACMA35R Related Products

	MR2A08ACMA35R	MR2A08AYS35	MR2A08ACMA35	MR2A08AMA35	MR2A08AMA35R	MR2A08AMYS35R	MR2A08AMYS35	MR2A08ACYS35R
Description	Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 512KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 256KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44	Memory Circuit, 256KX8, CMOS, PDSO44, 0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	TSOP2	BGA	BGA	BGA	TSOP2	TSOP2	TSOP2
package instruction	LFBGA,	TSOP2, TSOP44,.46,32	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA,	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32
Contacts	48	44	48	48	48	44	44	44
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	S-PBGA-B48	R-PDSO-G44	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
length	8 mm	18.41 mm	8 mm	8 mm	8 mm	18.41 mm	18.41 mm	18.41 mm
memory density	4194304 bi	4194304 bit	2097152 bit	2097152 bit	4194304 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	48	44	48	48	48	44	44	44
word count	524288 words	524288 words	262144 words	262144 words	524288 words	262144 words	262144 words	262144 words
character code	512000	512000	256000	256000	512000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-	-40 °C	-40 °C	-40 °C
organize	512KX8	512KX8	256KX8	256KX8	512KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	TSOP2	LFBGA	LFBGA	LFBGA	TSOP2	TSOP2	TSOP2
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	1.35 mm	1.2 mm	1.35 mm	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING
Terminal pitch	0.75 mm	0.8 mm	0.75 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	10.16 mm	8 mm	8 mm	8 mm	10.16 mm	10.16 mm	10.16 mm
Maximum access time	-	35 ns	35 ns	35 ns	-	35 ns	35 ns	35 ns
Mixed memory types	-	N/A	N/A	N/A	-	N/A	N/A	N/A
Encapsulate equivalent code	-	TSOP44,.46,32	BGA48,6X8,30	BGA48,6X8,30	-	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32
power supply	-	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	-	0.02 A	0.02 A	0.02 A	-	0.02 A	0.02 A	0.02 A
Maximum slew rate	-	0.135 mA	0.135 mA	0.135 mA	-	0.135 mA	0.135 mA	0.135 mA

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