UPD7564AG(A)-XXX datasheet, PDF - EEWORLD Datasheet

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UPD7564AG(A)-XXX: DescriptionMicrocontroller, 4-Bit, MROM, 0.71MHz, MOS, PDSO20, 0.300 INCH, PLASTIC, SOP-20; CategoryThe embedded processor and controller Microcontrollers and processors; File Size422KB，56 Pages; ManufacturerNEC Electronics

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UPD7564AG(A)-XXX Overview

Microcontroller, 4-Bit, MROM, 0.71MHz, MOS, PDSO20, 0.300 INCH, PLASTIC, SOP-20

UPD7564AG(A)-XXX Parametric

Parameter Name	Attribute value
Parts packaging code	SOIC
package instruction	SOP,
Contacts	20
Reach Compliance Code	unknown
Has ADC	NO
Address bus width
bit size	4
maximum clock frequency	0.71 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDSO-G20
length	13 mm
Number of I/O lines	15
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.8 mm
speed	0.71 MHz
Maximum supply voltage	6 V
Minimum supply voltage	2.7 V
surface mount	YES
technology	MOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	5.6 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

UPD7564AG(A)-XXX Related Products

	UPD7564AG(A)-XXX	UPD7564ACS(A)-XXX
Description	Microcontroller, 4-Bit, MROM, 0.71MHz, MOS, PDSO20, 0.300 INCH, PLASTIC, SOP-20	Microcontroller, 4-Bit, MROM, 0.71MHz, MOS, PDIP20, 0.300 INCH, PLASTIC, SDIP-20
Parts packaging code	SOIC	DIP
package instruction	SOP,	0.300 INCH, PLASTIC, SDIP-20
Contacts	20	20
Reach Compliance Code	unknown	unknown
Has ADC	NO	NO
bit size	4	4
maximum clock frequency	0.71 MHz	0.71 MHz
DAC channel	NO	NO
DMA channel	NO	NO
JESD-30 code	R-PDSO-G20	R-PDIP-T20
Number of I/O lines	15	15
Number of terminals	20	20
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SDIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified
ROM programmability	MROM	MROM
Maximum seat height	1.8 mm	5.08 mm
speed	0.71 MHz	0.71 MHz
Maximum supply voltage	6 V	6 V
Minimum supply voltage	2.7 V	2.7 V
surface mount	YES	NO
technology	MOS	MOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.778 mm
Terminal location	DUAL	DUAL
width	5.6 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER

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