FMIAA001xxx*DXANFGO
Thin Film Chip Attenuators
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
Surface mount chip attenuator ideal for applications (hybrid circuits)
requiring precision attenuation in a small form factor
Single component reduces circuit area and board space while
replacing discrete components and improving performance
Thin film technology ensures a stable attenuator over time and temperature
High reliability
Wire bondable pads on top surface
Ground wrap eliminates need for wire for shunt element
Solder or conductive epoxy attach
Excellent high-frequency response — DC through 22 GHz
50 Ohm impedance
Power rating 250 mW
Substrate 99.9% alumina with TaN/TiW/Ni/Au
Attenuation range of -1 dB to -20 dB in 1-dB steps
(0.5 dB or custom attenuations available)
Latched Soft Start to limit power consumption
* xxx specifies attenuation e.q. 050 is 5.0 dB.
ELECTRICAL DATA
Parameter
Specification
Frequency …………………………………..........................……. DC to 22 GHz
Attenuation ………………....................................................….. 1 to 20 dB in 1-dB increments
Attenuation Accuracy ……………………........................……… ±0.5 dB
Return Loss ………….......................................................……. 1.45:1 VSWR; -15 dB, DC to 15 GHz
1.90:1 VSWR; -10 dB, 15 to 22 GHz
Impedance …………..........................................………………. 50 Ohms
Power Rating …………………………….............................…... 250 mW, solder attach to heat sink
Size ..............................................................................….…... 60 X 75 X 10 mil
Substrate Material ………………………………..........………... 99.9% Alumina
Resistor Material ………....…………………………………….... Tantalum Nitride
Bond Pads ….........……....……………………………………..... Wire Bondable Gold
Backside Metal ……...…....…………………………………….... Solderable or Epoxy attach Ni/Au
Tel: 508-485-6350 Fax: 508-485-5168
165 Cedar Hill Street, Marlborough, MA 01752
www.SpectrumMicrowave.com
Spectrum Microwave