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FMIAA001180DXAFGO

Description
Fixed Attenuator, 0MHz Min, 22000MHz Max
CategoryWireless rf/communication    Radio frequency and microwave   
File Size322KB,2 Pages
ManufacturerAPI Technologies
Websitehttp://www.apitech.com/about-api
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FMIAA001180DXAFGO Overview

Fixed Attenuator, 0MHz Min, 22000MHz Max

FMIAA001180DXAFGO Parametric

Parameter NameAttribute value
MakerAPI Technologies
Reach Compliance Codecompliant
Nominal attenuation18 dB
Characteristic impedance50 Ω
structureCOMPONENT
Maximum input power (CW)23.98 dBm
Maximum operating frequency22000 MHz
Minimum operating frequency
RF/Microwave Device TypesFIXED ATTENUATOR
Maximum voltage standing wave ratio1.9
FMIAA001xxx*DXANFGO
Thin Film Chip Attenuators
FEATURES
Surface mount chip attenuator ideal for applications (hybrid circuits)
requiring precision attenuation in a small form factor
Single component reduces circuit area and board space while
replacing discrete components and improving performance
Thin film technology ensures a stable attenuator over time and temperature
High reliability
Wire bondable pads on top surface
Ground wrap eliminates need for wire for shunt element
Solder or conductive epoxy attach
Excellent high-frequency response — DC through 22 GHz
50 Ohm impedance
Power rating 250 mW
Substrate 99.9% alumina with TaN/TiW/Ni/Au
Attenuation range of -1 dB to -20 dB in 1-dB steps
(0.5 dB or custom attenuations available)
Latched Soft Start to limit power consumption
* xxx specifies attenuation e.q. 050 is 5.0 dB.
ELECTRICAL DATA
Parameter
Specification
Frequency …………………………………..........................……. DC to 22 GHz
Attenuation ………………....................................................….. 1 to 20 dB in 1-dB increments
Attenuation Accuracy ……………………........................……… ±0.5 dB
Return Loss ………….......................................................……. 1.45:1 VSWR; -15 dB, DC to 15 GHz
1.90:1 VSWR; -10 dB, 15 to 22 GHz
Impedance …………..........................................………………. 50 Ohms
Power Rating …………………………….............................…... 250 mW, solder attach to heat sink
Size ..............................................................................….…... 60 X 75 X 10 mil
Substrate Material ………………………………..........………... 99.9% Alumina
Resistor Material ………....…………………………………….... Tantalum Nitride
Bond Pads ….........……....……………………………………..... Wire Bondable Gold
Backside Metal ……...…....…………………………………….... Solderable or Epoxy attach Ni/Au
Tel: 508-485-6350 Fax: 508-485-5168
165 Cedar Hill Street, Marlborough, MA 01752
www.SpectrumMicrowave.com
Spectrum Microwave

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Maker API Technologies - - - API Technologies API Technologies API Technologies - API Technologies
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant - compliant
Nominal attenuation 18 dB 3 dB 17 dB 7 dB 2 dB 20 dB 1 dB - 11 dB
Characteristic impedance 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω - 50 Ω
structure COMPONENT COMPONENT COMPONENT COMPONENT COMPONENT COMPONENT COMPONENT - COMPONENT
Maximum input power (CW) 23.98 dBm 23.98 dBm 23.98 dBm 23.98 dBm 23.98 dBm 23.98 dBm 23.98 dBm - 23.98 dBm
Maximum operating frequency 22000 MHz 22000 MHz 22000 MHz 22000 MHz 22000 MHz 22000 MHz 22000 MHz - 22000 MHz
RF/Microwave Device Types FIXED ATTENUATOR FIXED ATTENUATOR FIXED ATTENUATOR FIXED ATTENUATOR FIXED ATTENUATOR FIXED ATTENUATOR FIXED ATTENUATOR - FIXED ATTENUATOR
Maximum voltage standing wave ratio 1.9 1.9 1.9 1.9 1.9 1.9 1.9 - 1.9

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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