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MLG0603Q4N7

Description
SMD Inductors(Coils) For High Frequency(Multilayer)
File Size68KB,6 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Download Datasheet View All

MLG0603Q4N7 Overview

SMD Inductors(Coils) For High Frequency(Multilayer)

(1/6)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG0603Q Type
FEATURES
• It serializes a product of acquisition inductance 0.3 to15nH. In a
product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.
• By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 0603 Q 2N2 S T
(1)
(2) (3) (4) (5) (6)
(1) Multilayer ceramic chip coil
(2) Dimensions
0603
0.6× 0.3mm (L× W)
(3) Series name
(4) Inductance value
2N2
12N
2.2nH
12nH
(5) Inductance tolerance
B
C
S
H
J
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
0.3±0.03
(6) Packaging style
T
0.06±0.04
Taping (reel)
SPECIFICATIONS
0.3±0.03
Operating temperature range
Storage temperature range
Weight: 0.2mg
–55 to +125°C
–55 to +125°C [Unit of products]
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
0.15±0.05
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
0.25 to 0.35
0.2 to 0.3 0.25 to 0.35 0.2 to 0.3
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
003-01 / 20070703 / e521_mlg0603q.fm
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