WS57C256F-55CMB datasheet, PDF

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WS57C256F-55CMB: DescriptionMILITARY HIGH SPEED 32K x 8 CMOS EPROM; Categorystorage storage; File Size13KB，2 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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WS57C256F-55CMB Overview

MILITARY HIGH SPEED 32K x 8 CMOS EPROM

WS57C256F-55CMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFJ
package instruction	CERAMIC, LLCC-32
Contacts	32
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	262144 bi
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B
Maximum seat height	3.3 mm
Maximum standby current	0.0005 A
Maximum slew rate	0.133 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm
Base Number Matches	1

WS57C256F-55CMB Related Products

	WS57C256F-55CMB	WS57C256F-70DMB	WS57C256F-70CMB	WS57C256F-70	WS57C256F-55TMB	WS57C256F-55DMB	WS57C256F-55	WS57C256F-1
Description	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM	MILITARY HIGH SPEED 32K x 8 CMOS EPROM
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible	incompatible	-	-
Parts packaging code	QFJ	DIP	QFJ	-	DIP	DIP	-	-
package instruction	CERAMIC, LLCC-32	0.600 INCH, CERDIP-28	CERAMIC, LLCC-32	-	0.300 INCH, CERDIP-28	0.600 INCH, CERDIP-28	-	-
Contacts	32	28	32	-	28	28	-	-
Reach Compliance Code	_compli	_compli	_compli	-	_compli	_compli	-	-
ECCN code	EAR99	EAR99	EAR99	-	EAR99	EAR99	-	-
Maximum access time	55 ns	70 ns	70 ns	-	55 ns	55 ns	-	-
I/O type	COMMON	COMMON	COMMON	-	COMMON	COMMON	-	-
JESD-30 code	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32	-	R-GDIP-T28	R-GDIP-T28	-	-
JESD-609 code	e0	e0	e0	-	e0	e0	-	-
length	13.97 mm	37.215 mm	13.97 mm	-	37.085 mm	37.215 mm	-	-
memory density	262144 bi	262144 bi	262144 bi	-	262144 bi	262144 bi	-	-
Memory IC Type	UVPROM	UVPROM	UVPROM	-	UVPROM	UVPROM	-	-
memory width	8	8	8	-	8	8	-	-
Number of functions	1	1	1	-	1	1	-	-
Number of terminals	32	28	32	-	28	28	-	-
word count	32768 words	32768 words	32768 words	-	32768 words	32768 words	-	-
character code	32000	32000	32000	-	32000	32000	-	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-	-
Maximum operating temperature	125 °C	125 °C	125 °C	-	125 °C	125 °C	-	-
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-	-
organize	32KX8	32KX8	32KX8	-	32KX8	32KX8	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	-	-
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	-	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	-	-
encapsulated code	WQCCN	WDIP	WQCCN	-	WDIP	WDIP	-	-
Encapsulate equivalent code	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	-	DIP28,.3	DIP28,.6	-	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	-
Package form	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	-	IN-LINE, WINDOW	IN-LINE, WINDOW	-	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	-	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	-
power supply	5 V	5 V	5 V	-	5 V	5 V	-	-
Programming voltage	12.5 V	12.5 V	12.5 V	-	12.5 V	12.5 V	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-	-
Filter level	MIL-STD-883 Class B	MIL-STD-883 Class B	MIL-STD-883 Class B	-	MIL-STD-883 Class B	MIL-STD-883 Class B	-	-
Maximum seat height	3.3 mm	5.72 mm	3.3 mm	-	5.08 mm	5.72 mm	-	-
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	-	0.0005 A	0.0005 A	-	-
Maximum slew rate	0.133 mA	0.117 mA	0.117 mA	-	0.133 mA	0.133 mA	-	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	-	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V	-	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	-	5 V	5 V	-	-
surface mount	YES	NO	YES	-	NO	NO	-	-
technology	CMOS	CMOS	CMOS	-	CMOS	CMOS	-	-
Temperature level	MILITARY	MILITARY	MILITARY	-	MILITARY	MILITARY	-	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	-	THROUGH-HOLE	THROUGH-HOLE	-	-
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	-	2.54 mm	2.54 mm	-	-
Terminal location	QUAD	DUAL	QUAD	-	DUAL	DUAL	-	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-	-
width	11.43 mm	15.24 mm	11.43 mm	-	7.62 mm	15.24 mm	-	-

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