MILITARY HIGH SPEED 32K x 8 CMOS EPROM
WS57C256F-1 | WS57C256F-70DMB | WS57C256F-70CMB | WS57C256F-70 | WS57C256F-55TMB | WS57C256F-55DMB | WS57C256F-55CMB | WS57C256F-55 | |
---|---|---|---|---|---|---|---|---|
Description | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM |
Is it Rohs certified? | - | incompatible | incompatible | - | incompatible | incompatible | incompatible | - |
Parts packaging code | - | DIP | QFJ | - | DIP | DIP | QFJ | - |
package instruction | - | 0.600 INCH, CERDIP-28 | CERAMIC, LLCC-32 | - | 0.300 INCH, CERDIP-28 | 0.600 INCH, CERDIP-28 | CERAMIC, LLCC-32 | - |
Contacts | - | 28 | 32 | - | 28 | 28 | 32 | - |
Reach Compliance Code | - | _compli | _compli | - | _compli | _compli | _compli | - |
ECCN code | - | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
Maximum access time | - | 70 ns | 70 ns | - | 55 ns | 55 ns | 55 ns | - |
I/O type | - | COMMON | COMMON | - | COMMON | COMMON | COMMON | - |
JESD-30 code | - | R-GDIP-T28 | R-CQCC-N32 | - | R-GDIP-T28 | R-GDIP-T28 | R-CQCC-N32 | - |
JESD-609 code | - | e0 | e0 | - | e0 | e0 | e0 | - |
length | - | 37.215 mm | 13.97 mm | - | 37.085 mm | 37.215 mm | 13.97 mm | - |
memory density | - | 262144 bi | 262144 bi | - | 262144 bi | 262144 bi | 262144 bi | - |
Memory IC Type | - | UVPROM | UVPROM | - | UVPROM | UVPROM | UVPROM | - |
memory width | - | 8 | 8 | - | 8 | 8 | 8 | - |
Number of functions | - | 1 | 1 | - | 1 | 1 | 1 | - |
Number of terminals | - | 28 | 32 | - | 28 | 28 | 32 | - |
word count | - | 32768 words | 32768 words | - | 32768 words | 32768 words | 32768 words | - |
character code | - | 32000 | 32000 | - | 32000 | 32000 | 32000 | - |
Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
Maximum operating temperature | - | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
Minimum operating temperature | - | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | - |
organize | - | 32KX8 | 32KX8 | - | 32KX8 | 32KX8 | 32KX8 | - |
Output characteristics | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
Package body material | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - |
encapsulated code | - | WDIP | WQCCN | - | WDIP | WDIP | WQCCN | - |
Encapsulate equivalent code | - | DIP28,.6 | LCC32,.45X.55 | - | DIP28,.3 | DIP28,.6 | LCC32,.45X.55 | - |
Package shape | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
Package form | - | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | - | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | - |
Parallel/Serial | - | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
power supply | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
Programming voltage | - | 12.5 V | 12.5 V | - | 12.5 V | 12.5 V | 12.5 V | - |
Certification status | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
Filter level | - | MIL-STD-883 Class B | MIL-STD-883 Class B | - | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - |
Maximum seat height | - | 5.72 mm | 3.3 mm | - | 5.08 mm | 5.72 mm | 3.3 mm | - |
Maximum standby current | - | 0.0005 A | 0.0005 A | - | 0.0005 A | 0.0005 A | 0.0005 A | - |
Maximum slew rate | - | 0.117 mA | 0.117 mA | - | 0.133 mA | 0.133 mA | 0.133 mA | - |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - |
Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - |
Nominal supply voltage (Vsup) | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
surface mount | - | NO | YES | - | NO | NO | YES | - |
technology | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
Temperature level | - | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | - |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | - | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - |
Terminal pitch | - | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | - |
Terminal location | - | DUAL | QUAD | - | DUAL | DUAL | QUAD | - |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
width | - | 15.24 mm | 11.43 mm | - | 7.62 mm | 15.24 mm | 11.43 mm | - |