MILITARY HIGH SPEED 32K x 8 CMOS EPROM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | DIP |
| package instruction | 0.600 INCH, CERDIP-28 |
| Contacts | 28 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| length | 37.215 mm |
| memory density | 262144 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 5.72 mm |
| Maximum standby current | 0.0005 A |
| Maximum slew rate | 0.117 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| WS57C256F-70DMB | WS57C256F-70CMB | WS57C256F-70 | WS57C256F-55TMB | WS57C256F-55DMB | WS57C256F-55CMB | WS57C256F-55 | WS57C256F-1 | |
|---|---|---|---|---|---|---|---|---|
| Description | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM | MILITARY HIGH SPEED 32K x 8 CMOS EPROM |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | incompatible | - | - |
| Parts packaging code | DIP | QFJ | - | DIP | DIP | QFJ | - | - |
| package instruction | 0.600 INCH, CERDIP-28 | CERAMIC, LLCC-32 | - | 0.300 INCH, CERDIP-28 | 0.600 INCH, CERDIP-28 | CERAMIC, LLCC-32 | - | - |
| Contacts | 28 | 32 | - | 28 | 28 | 32 | - | - |
| Reach Compliance Code | _compli | _compli | - | _compli | _compli | _compli | - | - |
| ECCN code | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | - |
| Maximum access time | 70 ns | 70 ns | - | 55 ns | 55 ns | 55 ns | - | - |
| I/O type | COMMON | COMMON | - | COMMON | COMMON | COMMON | - | - |
| JESD-30 code | R-GDIP-T28 | R-CQCC-N32 | - | R-GDIP-T28 | R-GDIP-T28 | R-CQCC-N32 | - | - |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 | - | - |
| length | 37.215 mm | 13.97 mm | - | 37.085 mm | 37.215 mm | 13.97 mm | - | - |
| memory density | 262144 bi | 262144 bi | - | 262144 bi | 262144 bi | 262144 bi | - | - |
| Memory IC Type | UVPROM | UVPROM | - | UVPROM | UVPROM | UVPROM | - | - |
| memory width | 8 | 8 | - | 8 | 8 | 8 | - | - |
| Number of functions | 1 | 1 | - | 1 | 1 | 1 | - | - |
| Number of terminals | 28 | 32 | - | 28 | 28 | 32 | - | - |
| word count | 32768 words | 32768 words | - | 32768 words | 32768 words | 32768 words | - | - |
| character code | 32000 | 32000 | - | 32000 | 32000 | 32000 | - | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| Maximum operating temperature | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | - | - |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | - | - |
| organize | 32KX8 | 32KX8 | - | 32KX8 | 32KX8 | 32KX8 | - | - |
| Output characteristics | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | - |
| encapsulated code | WDIP | WQCCN | - | WDIP | WDIP | WQCCN | - | - |
| Encapsulate equivalent code | DIP28,.6 | LCC32,.45X.55 | - | DIP28,.3 | DIP28,.6 | LCC32,.45X.55 | - | - |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| Package form | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | - | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | - | - |
| Parallel/Serial | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| power supply | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | - |
| Programming voltage | 12.5 V | 12.5 V | - | 12.5 V | 12.5 V | 12.5 V | - | - |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - |
| Filter level | MIL-STD-883 Class B | MIL-STD-883 Class B | - | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - |
| Maximum seat height | 5.72 mm | 3.3 mm | - | 5.08 mm | 5.72 mm | 3.3 mm | - | - |
| Maximum standby current | 0.0005 A | 0.0005 A | - | 0.0005 A | 0.0005 A | 0.0005 A | - | - |
| Maximum slew rate | 0.117 mA | 0.117 mA | - | 0.133 mA | 0.133 mA | 0.133 mA | - | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | - |
| surface mount | NO | YES | - | NO | NO | YES | - | - |
| technology | CMOS | CMOS | - | CMOS | CMOS | CMOS | - | - |
| Temperature level | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| Terminal form | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | - |
| Terminal pitch | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | - | - |
| Terminal location | DUAL | QUAD | - | DUAL | DUAL | QUAD | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| width | 15.24 mm | 11.43 mm | - | 7.62 mm | 15.24 mm | 11.43 mm | - | - |
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