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LTC4303CDD#TRPBF

Description
IC ACCELERATOR I2C HOTSWAP 8DFN
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size525KB,12 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
Environmental Compliance
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LTC4303CDD#TRPBF Overview

IC ACCELERATOR I2C HOTSWAP 8DFN

LTC4303CDD#TRPBF Parametric

Parameter NameAttribute value
Brand NameLinear Technology
Is it Rohs certified?conform to
MakerLinear ( ADI )
Parts packaging codeDFN
package instructionHVSON, SOLCC8,.11,20
Contacts8
Manufacturer packaging codeDD
Reach Compliance Codecompliant
ECCN codeEAR99
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PDSO-N8
JESD-609 codee3
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.11,20
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Maximum slew rate8 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm

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Description IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN Application: I²C - Hot-Plug Output Type: 2-Wire Bus Input Type: 2-Wire Bus Type: Buffer, Accelerometer Data Rate: 400Kbps Latency: - Hot-Plugable 2-Wire Bus with Blocked Bus Recovery buffer IC SPECIALTY INTERFACE CIRCUIT, PDSO8, 3 X 3 MM, PLASTIC, MO-229WEED-1, DFN-8, Interface IC:Other
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to incompatible
Maker Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code DFN DFN MSOP DFN MSOP MSOP DFN MSOP SON
package instruction HVSON, SOLCC8,.11,20 HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19 HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.19 HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19 HVSON, SOLCC8,.11,20
Contacts 8 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PDSO-N8 S-PDSO-N8 S-PDSO-G8 S-PDSO-N8 S-PDSO-G8 S-PDSO-G8 S-PDSO-N8 S-PDSO-G8 S-PDSO-N8
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e0
length 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON HVSON TSSOP HVSON TSSOP TSSOP HVSON TSSOP HVSON
Encapsulate equivalent code SOLCC8,.11,20 SOLCC8,.11,20 TSSOP8,.19 SOLCC8,.11,20 TSSOP8,.19 TSSOP8,.19 SOLCC8,.11,20 TSSOP8,.19 SOLCC8,.11,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260 235
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.8 mm 0.8 mm 1.1 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm 1.1 mm 0.8 mm
Maximum slew rate 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.65 mm 0.5 mm 0.65 mm 0.65 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30 20
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology -
Manufacturer packaging code DD DD MS8 DD MS8 MS8 DD MS8 -
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