|
LTC4303CDD#TRPBF |
LTC4303CDD#PBF |
LTC4303CMS8#PBF |
LTC4303IDD#PBF |
LTC4303CMS8#TRPBF |
LTC4303IMS8#TRPBF |
LTC4303IDD#TRPBF |
LTC4303IMS8#PBF |
LTC4303CDD#TR |
Description |
IC ACCELERATOR I2C HOTSWAP 8DFN |
IC ACCELERATOR I2C HOTSWAP 8DFN |
IC ACCELERATOR I2C HOTSWAP 8MSOP |
IC ACCELERATOR I2C HOTSWAP 8DFN |
IC ACCELERATOR I2C HOTSWAP 8MSOP |
IC ACCELERATOR I2C HOTSWAP 8MSOP |
IC ACCELERATOR I2C HOTSWAP 8DFN |
Application: I²C - Hot-Plug Output Type: 2-Wire Bus Input Type: 2-Wire Bus Type: Buffer, Accelerometer Data Rate: 400Kbps Latency: - Hot-Plugable 2-Wire Bus with Blocked Bus Recovery buffer |
IC SPECIALTY INTERFACE CIRCUIT, PDSO8, 3 X 3 MM, PLASTIC, MO-229WEED-1, DFN-8, Interface IC:Other |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
incompatible |
Maker |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Linear ( ADI ) |
Parts packaging code |
DFN |
DFN |
MSOP |
DFN |
MSOP |
MSOP |
DFN |
MSOP |
SON |
package instruction |
HVSON, SOLCC8,.11,20 |
HVSON, SOLCC8,.11,20 |
TSSOP, TSSOP8,.19 |
HVSON, SOLCC8,.11,20 |
TSSOP, TSSOP8,.19 |
TSSOP, TSSOP8,.19 |
HVSON, SOLCC8,.11,20 |
TSSOP, TSSOP8,.19 |
HVSON, SOLCC8,.11,20 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Interface integrated circuit type |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
JESD-30 code |
S-PDSO-N8 |
S-PDSO-N8 |
S-PDSO-G8 |
S-PDSO-N8 |
S-PDSO-G8 |
S-PDSO-G8 |
S-PDSO-N8 |
S-PDSO-G8 |
S-PDSO-N8 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
e0 |
length |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
85 °C |
70 °C |
85 °C |
85 °C |
85 °C |
70 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
HVSON |
TSSOP |
HVSON |
TSSOP |
TSSOP |
HVSON |
TSSOP |
HVSON |
Encapsulate equivalent code |
SOLCC8,.11,20 |
SOLCC8,.11,20 |
TSSOP8,.19 |
SOLCC8,.11,20 |
TSSOP8,.19 |
TSSOP8,.19 |
SOLCC8,.11,20 |
TSSOP8,.19 |
SOLCC8,.11,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
235 |
power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.8 mm |
0.8 mm |
1.1 mm |
0.8 mm |
1.1 mm |
1.1 mm |
0.8 mm |
1.1 mm |
0.8 mm |
Maximum slew rate |
8 mA |
8 mA |
8 mA |
8 mA |
8 mA |
8 mA |
8 mA |
8 mA |
8 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
0.65 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.5 mm |
0.65 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
30 |
30 |
20 |
width |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Brand Name |
Linear Technology |
Linear Technology |
Linear Technology |
Linear Technology |
Linear Technology |
Linear Technology |
Linear Technology |
Linear Technology |
- |
Manufacturer packaging code |
DD |
DD |
MS8 |
DD |
MS8 |
MS8 |
DD |
MS8 |
- |