LTC4303CMS8#PBF datasheet, PDF

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LTC4303CMS8#PBF: DescriptionIC ACCELERATOR I2C HOTSWAP 8MSOP; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size525KB，12 Pages; ManufacturerLinear ( ADI ); Websitehttp://www.analog.com/cn/index.html; Environmental Compliance

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LTC4303CMS8#PBF Overview

IC ACCELERATOR I2C HOTSWAP 8MSOP

LTC4303CMS8#PBF Parametric

Parameter Name	Attribute value
Brand Name	Linear Technology
Is it Rohs certified?	conform to
Maker	Linear ( ADI )
Parts packaging code	MSOP
package instruction	TSSOP, TSSOP8,.19
Contacts	8
Manufacturer packaging code	MS8
Reach Compliance Code	compliant
ECCN code	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G8
JESD-609 code	e3
length	3 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.19
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum slew rate	8 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3 mm

LTC4303CMS8#PBF Related Products

	LTC4303CMS8#PBF	LTC4303CDD#PBF	LTC4303IDD#PBF	LTC4303CMS8#TRPBF	LTC4303CDD#TRPBF	LTC4303IMS8#TRPBF	LTC4303IDD#TRPBF	LTC4303IMS8#PBF	LTC4303CDD#TR
Description	IC ACCELERATOR I2C HOTSWAP 8MSOP	IC ACCELERATOR I2C HOTSWAP 8DFN	IC ACCELERATOR I2C HOTSWAP 8DFN	IC ACCELERATOR I2C HOTSWAP 8MSOP	IC ACCELERATOR I2C HOTSWAP 8DFN	IC ACCELERATOR I2C HOTSWAP 8MSOP	IC ACCELERATOR I2C HOTSWAP 8DFN	Application: I²C - Hot-Plug Output Type: 2-Wire Bus Input Type: 2-Wire Bus Type: Buffer, Accelerometer Data Rate: 400Kbps Latency: - Hot-Plugable 2-Wire Bus with Blocked Bus Recovery buffer	IC SPECIALTY INTERFACE CIRCUIT, PDSO8, 3 X 3 MM, PLASTIC, MO-229WEED-1, DFN-8, Interface IC:Other
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	incompatible
Maker	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )
Parts packaging code	MSOP	DFN	DFN	MSOP	DFN	MSOP	DFN	MSOP	SON
package instruction	TSSOP, TSSOP8,.19	HVSON, SOLCC8,.11,20	HVSON, SOLCC8,.11,20	TSSOP, TSSOP8,.19	HVSON, SOLCC8,.11,20	TSSOP, TSSOP8,.19	HVSON, SOLCC8,.11,20	TSSOP, TSSOP8,.19	HVSON, SOLCC8,.11,20
Contacts	8	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G8	S-PDSO-N8	S-PDSO-N8	S-PDSO-G8	S-PDSO-N8	S-PDSO-G8	S-PDSO-N8	S-PDSO-G8	S-PDSO-N8
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3	e0
length	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
Humidity sensitivity level	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8	8
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	HVSON	HVSON	TSSOP	HVSON	TSSOP	HVSON	TSSOP	HVSON
Encapsulate equivalent code	TSSOP8,.19	SOLCC8,.11,20	SOLCC8,.11,20	TSSOP8,.19	SOLCC8,.11,20	TSSOP8,.19	SOLCC8,.11,20	TSSOP8,.19	SOLCC8,.11,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	235
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	0.8 mm	0.8 mm	1.1 mm	0.8 mm	1.1 mm	0.8 mm	1.1 mm	0.8 mm
Maximum slew rate	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	NO LEAD	NO LEAD	GULL WING	NO LEAD	GULL WING	NO LEAD	GULL WING	NO LEAD
Terminal pitch	0.65 mm	0.5 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	20
width	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
Brand Name	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	-
Manufacturer packaging code	MS8	DD	DD	MS8	DD	MS8	DD	MS8	-

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