IC ACCELERATOR I2C HOTSWAP 8DFN
| Parameter Name | Attribute value |
| Brand Name | Linear Technology |
| Is it Rohs certified? | conform to |
| Maker | Linear ( ADI ) |
| Parts packaging code | DFN |
| package instruction | HVSON, SOLCC8,.11,20 |
| Contacts | 8 |
| Manufacturer packaging code | DD |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Interface integrated circuit type | INTERFACE CIRCUIT |
| JESD-30 code | S-PDSO-N8 |
| JESD-609 code | e3 |
| length | 3 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC8,.11,20 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum slew rate | 8 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 2.7 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| LTC4303IDD#TRPBF | LTC4303CDD#PBF | LTC4303CMS8#PBF | LTC4303IDD#PBF | LTC4303CMS8#TRPBF | LTC4303CDD#TRPBF | LTC4303IMS8#TRPBF | LTC4303IMS8#PBF | LTC4303CDD#TR | |
|---|---|---|---|---|---|---|---|---|---|
| Description | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP | IC ACCELERATOR I2C HOTSWAP 8DFN | IC ACCELERATOR I2C HOTSWAP 8MSOP | Application: I²C - Hot-Plug Output Type: 2-Wire Bus Input Type: 2-Wire Bus Type: Buffer, Accelerometer Data Rate: 400Kbps Latency: - Hot-Plugable 2-Wire Bus with Blocked Bus Recovery buffer | IC SPECIALTY INTERFACE CIRCUIT, PDSO8, 3 X 3 MM, PLASTIC, MO-229WEED-1, DFN-8, Interface IC:Other |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | incompatible |
| Maker | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| Parts packaging code | DFN | DFN | MSOP | DFN | MSOP | DFN | MSOP | MSOP | SON |
| package instruction | HVSON, SOLCC8,.11,20 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | HVSON, SOLCC8,.11,20 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Interface integrated circuit type | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 code | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-N8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e0 |
| length | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVSON | HVSON | TSSOP | HVSON | TSSOP | HVSON | TSSOP | TSSOP | HVSON |
| Encapsulate equivalent code | SOLCC8,.11,20 | SOLCC8,.11,20 | TSSOP8,.19 | SOLCC8,.11,20 | TSSOP8,.19 | SOLCC8,.11,20 | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.11,20 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 235 |
| power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.8 mm | 0.8 mm | 1.1 mm | 0.8 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.8 mm |
| Maximum slew rate | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 20 |
| width | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - |
| Manufacturer packaging code | DD | DD | MS8 | DD | MS8 | DD | MS8 | MS8 | - |
FPGA/CPLD
Innovation Lab
Talking
Microcontroller MCU
RF/Wirelessly
stm32/stm8
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD