AWT6135M7P8 datasheet, PDF - EEWORLD Datasheet

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AWT6135M7P8: DescriptionRF and Baseband Circuit, 4 X 4 MM, 1.50 MM HEIGHT, MODULE, 10 PIN; CategoryTelecom circuit; File Size323KB，12 Pages; ManufacturerII-VI Incorporated

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AWT6135M7P8 Overview

RF and Baseband Circuit, 4 X 4 MM, 1.50 MM HEIGHT, MODULE, 10 PIN

AWT6135M7P8 Parametric

Parameter Name	Attribute value
Maker	II-VI Incorporated
package instruction	HLSON,
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	S-XDSO-N10
length	4 mm
Number of functions	1
Number of terminals	10
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
Package body material	UNSPECIFIED
encapsulated code	HLSON
Package shape	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Certification status	Not Qualified
Maximum seat height	1.56 mm
Nominal supply voltage	3.4 V
surface mount	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	0.85 mm
Terminal location	DUAL
width	4 mm
Base Number Matches	1

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AWT6135

PCS/CDMA 3.4V/28dBm

Linear Power Amplifier Module

PRELIMINARY DATA SHEET - Rev 1.5

FEATURES

•

InGaP HBT Technology

High Efficiency: 39%

Low Quiescent Current: 50 mA

Low Leakage Current in Shutdown Mode: <1

µA

REF

= +2.8 V (+2.7 V min over temp)

Optimized for a 50

Ω

System

Low Profile Miniature Surface Mount Package:

1.56 mm Max

RoHS-Compliant Package Option, 250

C MSL-3

CDMA 1XRTT Compliant

CDMA 1xEV-DO Compliant

APPLICATIONS

•

PCS CDMA Wireless Handsets

Dual Band CDMA Wireless Handsets

M7 Package

10 Pin 4 mm x 4 mm x 1.5 mm

Surface Mount Module

PRODUCT DESCRIPTION

The AWT6135 meets the increasing demands for

higher efficiency and linearity in CDMA 1XRTT

handsets. The PA module is optimized for V

REF

= +2.8 V,

a requirement for compatibility with the Qualcomm®

6000 chipset. The device is manufactured on an

advanced InGaP HBT MMIC technology offering

state-of-the-art reliability, temperature stability, and

ruggedness. Selectable bias modes that optimize

efficiency for different output power levels, and a

shutdown mode with low leakage current, increase

handset talk and standby time. The self-contained

4 mm x 4 mm x 1.5 mm surface mount package

incorporates matching networks optimized for output

power, efficiency, and linearity in a 50

Ω

system.

GND at slug (pad)

GND

Bias Control

GND

OUT

GND

MODE

REF

Figure 1: Block Diagram

06/2005

AWT6135M7P8 Related Products

	AWT6135M7P8	AWT6135RM7P8
Description	RF and Baseband Circuit, 4 X 4 MM, 1.50 MM HEIGHT, MODULE, 10 PIN	RF and Baseband Circuit, 4 X 4 MM, 1.50 MM HEIGHT, ROHS COMPLIANT, MODULE, 10 PIN
Maker	II-VI Incorporated	II-VI Incorporated
package instruction	HLSON,	HLSON,
Reach Compliance Code	unknown	unknown
Is Samacsys	N	N
JESD-30 code	S-XDSO-N10	S-XDSO-N10
length	4 mm	4 mm
Number of functions	1	1
Number of terminals	10	10
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	HLSON	HLSON
Package shape	SQUARE	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.56 mm	1.56 mm
Nominal supply voltage	3.4 V	3.4 V
surface mount	YES	YES
Telecom integrated circuit types	RF AND BASEBAND CIRCUIT	RF AND BASEBAND CIRCUIT
Temperature level	OTHER	OTHER
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.85 mm	0.85 mm
Terminal location	DUAL	DUAL
width	4 mm	4 mm
Base Number Matches	1	1

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