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72201L15JGI

Description
FIFO, 256X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
Categorystorage    storage   
File Size109KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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72201L15JGI Overview

FIFO, 256X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32

72201L15JGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeQFJ
package instruction,
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time10 ns
period time15 ns
JESD-30 codeR-PLCC-J32
JESD-609 codee3
memory density2304 bit
Memory IC TypeOTHER FIFO
memory width9
Humidity sensitivity level1
Number of functions1
Number of terminals32
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X9
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum standby current0.005 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formJ BEND
Terminal locationQUAD
Maximum time at peak reflow temperature30
Base Number Matches1
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
CMOS SyncFIFO
64 x 9, 256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9 and 8,192 x 9
IDT72421, IDT72201
IDT72211, IDT72221
IDT72231, IDT72241
IDT72251
FEATURES:
64 x 9-bit organization (IDT72421)
256 x 9-bit organization (IDT72201)
512 x 9-bit organization (IDT72211)
1,024 x 9-bit organization (IDT72221)
2,048 x 9-bit organization (IDT72231)
4,096 x 9-bit organization (IDT72241)
8,192 x 9-bit organization (IDT72251)
10 ns read/write cycle time
Read and Write Clocks can be independent
Dual-Ported zero fall-through time architecture
Empty and Full Flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags can be set
to any depth
Programmable Almost-Empty and Almost-Full flags default to
Empty+7, and Full-7, respectively
Output enable puts output data bus in high-impedance state
Advanced submicron CMOS technology
Available in the 32-pin plastic leaded chip carrier (PLCC) and
32-pin Thin Quad Flat Pack (TQFP)
For through-hole product please see the IDT72420/72200/72210/
72220/72230/72240 data sheet
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
The IDT72421/72201/72211/72221/72231/72241/72251 SyncFIFO™
are very high-speed, low-power First-In, First-Out (FIFO) memories with
clocked read and write controls. These devices have a 64, 256, 512, 1,024,
2,048, 4,096, and 8,192 x 9-bit memory array, respectively. These FIFOs are
applicable for a wide variety of data buffering needs such as graphics, local area
networks and interprocessor communication.
These FIFOs have 9-bit input and output ports. The input port is controlled
by a free-running clock (WCLK), and two write enable pins (WEN1, WEN2).
Data is written into the Synchronous FIFO on every rising clock edge when
the write enable pins are asserted. The output port is controlled by another clock
pin (RCLK) and two read enable pins (REN1,
REN2).
The Read Clock can
be tied to the Write Clock for single clock operation or the two clocks can run
asynchronous of one another for dual-clock operation. An output enable pin
(OE) is provided on the read port for three-state control of the output.
The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF).
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are
provided for improved system control. The programmable flags default to
Empty+7 and Full-7 for
PAE
and
PAF,
respectively. The programmable flag
offset loading is controlled by a simple state machine and is initiated by asserting
the load pin (LD).
These FIFOs are fabricated using high-speed submicron CMOS technology.
DESCRIPTION:
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN1
WEN2
D
0
- D
8
LD
INPUT REGISTER
OFFSET REGISTER
EF
PAE
PAF
FF
WRITE CONTROL
LOGIC
RAM ARRAY
64 x 9, 256 x 9,
512 x 9, 1,024 x 9,
2,048 x 9, 4,096 x 9,
8,192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RCLK
REN1
REN2
RS
OE
Q
0
- Q
8
2655 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SyncFIFO is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2017
NOVEMBER 2017
DSC-2655/7
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.

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Description FIFO, 256X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 FIFO, 64X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 FIFO, 64X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 FIFO, 512X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32 FIFO, 256X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code QFJ QFJ QFJ QFJ QFJ
package instruction , LCC-32 , LCC-32 LCC-32
Contacts 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 10 ns 10 ns 10 ns 10 ns 10 ns
period time 15 ns 15 ns 15 ns 15 ns 15 ns
JESD-30 code R-PLCC-J32 R-PLCC-J32 R-PLCC-J32 R-PLCC-J32 R-PLCC-J32
JESD-609 code e3 e3 e3 e3 e3
memory density 2304 bit 576 bit 576 bit 4608 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9
Humidity sensitivity level 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 32 32 32 32 32
word count 256 words 64 words 64 words 512 words 256 words
character code 256 64 64 512 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -
organize 256X9 64X9 64X9 512X9 256X9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
Maximum slew rate 0.035 mA 0.035 mA 0.035 mA 0.035 mA 0.035 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form J BEND J BEND J BEND J BEND J BEND
Terminal location QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 30 30
Base Number Matches 1 1 1 1 1
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