AT91SAM9CN11-CUR datasheet, PDF

AT91SAM9CN11-CUR: DescriptionMicroprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A; CategoryThe embedded processor and controller Microcontrollers and processors; File Size315KB，29 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Reach Compliance Code	compliant
Factory Lead Time	12 weeks
bit size	32
JESD-30 code	S-PBGA-B217
JESD-609 code	e8
Humidity sensitivity level	3
Number of terminals	217
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA217,17X17,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	1,1.8/3.3,3.3 V
Certification status	Not Qualified
speed	400 MHz
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

	AT91SAM9CN11-CUR	AT91SAM9CN12B-CUR
Description	Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A	Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	Microchip	Microchip
Reach Compliance Code	compliant	compliant
Factory Lead Time	12 weeks	6 weeks
bit size	32	32
JESD-30 code	S-PBGA-B217	S-PBGA-B217
JESD-609 code	e8	e1
Humidity sensitivity level	3	3
Number of terminals	217	217
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	LFBGA
Encapsulate equivalent code	BGA217,17X17,32	BGA217,17X17,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	1,1.8/3.3,3.3 V	1,1.8/3.3,3.3 V
Certification status	Not Qualified	Not Qualified
speed	400 MHz	400 MHz
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)	TIN SILVER COPPER
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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