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AT91SAM9CN12B-CUR

Description
Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size315KB,29 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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AT91SAM9CN12B-CUR Overview

Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A

AT91SAM9CN12B-CUR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
package instructionLFBGA, BGA217,17X17,32
Reach Compliance Codecompliant
Factory Lead Time6 weeks
Address bus width26
bit size32
boundary scanYES
maximum clock frequency50 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B217
JESD-609 codee1
length15 mm
low power modeYES
Humidity sensitivity level3
Number of terminals217
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA217,17X17,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply1,1.8/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
speed400 MHz
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width15 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

AT91SAM9CN12B-CUR Related Products

AT91SAM9CN12B-CUR AT91SAM9CN11-CUR
Description Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Microchip Microchip
Reach Compliance Code compliant compliant
Factory Lead Time 6 weeks 12 weeks
bit size 32 32
JESD-30 code S-PBGA-B217 S-PBGA-B217
JESD-609 code e1 e8
Humidity sensitivity level 3 3
Number of terminals 217 217
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA FBGA
Encapsulate equivalent code BGA217,17X17,32 BGA217,17X17,32
Package shape SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
power supply 1,1.8/3.3,3.3 V 1,1.8/3.3,3.3 V
Certification status Not Qualified Not Qualified
speed 400 MHz 400 MHz
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
Terminal form BALL BALL
Terminal pitch 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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