Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microchip |
package instruction | LFBGA, BGA217,17X17,32 |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
Address bus width | 26 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 50 MHz |
External data bus width | 32 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B217 |
JESD-609 code | e1 |
length | 15 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 217 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA217,17X17,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1,1.8/3.3,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
speed | 400 MHz |
Maximum supply voltage | 1.1 V |
Minimum supply voltage | 0.9 V |
Nominal supply voltage | 1 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 15 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
AT91SAM9CN12B-CUR | AT91SAM9CN11-CUR | |
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Description | Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A | Microprocessors - MPU BGAGREEN,IND TEMP,CRYPTO, MRL A |
Is it lead-free? | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to |
Maker | Microchip | Microchip |
Reach Compliance Code | compliant | compliant |
Factory Lead Time | 6 weeks | 12 weeks |
bit size | 32 | 32 |
JESD-30 code | S-PBGA-B217 | S-PBGA-B217 |
JESD-609 code | e1 | e8 |
Humidity sensitivity level | 3 | 3 |
Number of terminals | 217 | 217 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | FBGA |
Encapsulate equivalent code | BGA217,17X17,32 | BGA217,17X17,32 |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH |
power supply | 1,1.8/3.3,3.3 V | 1,1.8/3.3,3.3 V |
Certification status | Not Qualified | Not Qualified |
speed | 400 MHz | 400 MHz |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) |
Terminal form | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |