SRAM 8K x 9 Sync, Dual-Port RAM, Pipelined/Flow-Through
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | CABGA |
| package instruction | 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 |
| Contacts | 100 |
| Manufacturer packaging code | BF100 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 9 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Maximum clock frequency (fCLK) | 66 MHz |
| I/O type | COMMON |
| JESD-30 code | S-PBGA-B100 |
| JESD-609 code | e0 |
| length | 10 mm |
| memory density | 73728 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 9 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 100 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Encapsulate equivalent code | BGA100,10X10,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum standby current | 0.003 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.36 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10 mm |
| Base Number Matches | 1 |
| 709159L9BF | 709159L6BF | 709159L9PF | |
|---|---|---|---|
| Description | SRAM 8K x 9 Sync, Dual-Port RAM, Pipelined/Flow-Through | SRAM 8K x 9 Sync, Dual-Port RAM, Pipelined/Flow-Through | SRAM 8K X 9 DP SRAM |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | CABGA | CABGA | TQFP |
| package instruction | 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 | 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 | 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 |
| Contacts | 100 | 100 | 100 |
| Manufacturer packaging code | BF100 | BF100 | PN100 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 9 ns | 6.5 ns | 9 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Maximum clock frequency (fCLK) | 66 MHz | 100 MHz | 66 MHz |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | S-PBGA-B100 | S-PBGA-B100 | S-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 |
| length | 10 mm | 10 mm | 14 mm |
| memory density | 73728 bit | 73728 bit | 73728 bit |
| Memory IC Type | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| memory width | 9 | 9 | 9 |
| Humidity sensitivity level | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 |
| Number of terminals | 100 | 100 | 100 |
| word count | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 8KX9 | 8KX9 | 8KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFBGA | LFBGA | LFQFP |
| Encapsulate equivalent code | BGA100,10X10,32 | BGA100,10X10,32 | QFP100,.63SQ,20 |
| Package shape | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 240 |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.4 mm | 1.4 mm | 1.4 mm |
| Maximum standby current | 0.003 A | 0.003 A | 0.003 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.36 mA | 0.43 mA | 0.36 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) |
| Terminal form | BALL | BALL | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.5 mm |
| Terminal location | BOTTOM | BOTTOM | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 20 |
| width | 10 mm | 10 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
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