709159L9PF datasheet, PDF - EEWORLD Datasheet

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709159L9PF: DescriptionSRAM 8K X 9 DP SRAM; Categorystorage storage; File Size168KB，16 Pages; ManufacturerIDT (Integrated Device Technology)

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709159L9PF Overview

SRAM 8K X 9 DP SRAM

709159L9PF Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	TQFP
package instruction	14 X 14 MM, 1.4 MM HEIGHT, TQFP-100
Contacts	100
Manufacturer packaging code	PN100
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	9 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	66 MHz
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	73728 bit
Memory IC Type	DUAL-PORT SRAM
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX9
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.003 A
Minimum standby current	4.5 V
Maximum slew rate	0.36 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm
Base Number Matches	1

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HIGH-SPEED 16/8K x 9

SYNCHRONOUS PIPELINED

DUAL-PORT STATIC RAM

Features

◆

IDT709169/59L

◆

True Dual-Ported memory cells which allow simultaneous

access of the same memory location

High-speed clock to data access

– Commercial: 6.5/7.5/9ns (max.)

Industrial: 7.5ns (max.)

Low-power operation

– IDT709169/59L

Active: 925mW (typ.)

Standby: 2.5mW (typ.)

Flow-Through or Pipelined output mode on either Port via

the

FT/PIPE

pins

Counter enable and reset features

Dual chip enables allow for depth expansion without

additional logic

◆

Full synchronous operation on both ports

– 3.5ns setup to clock and 0ns hold on all control, data, and

address inputs

– Data input, address, and control registers

– Fast 6.5ns clock to data out in the Pipelined output mode

– Self-timed write allows fast cycle time

– 10ns cycle time,100MHz operation in Pipelined output mode

TTL- compatible, single 5V (±10%) power supply

Industrial temperature range (–40°C to +85°C) is

available for 83MHz

Available in a 100-pin Thin Quad Flatpack (TQFP) and 100-

pin fine pitch Ball Grid Array (fpBGA) packages.

Functional Block Diagram

R/W

0/1

FT/PIPE

0/1

FT/PIPE

I/O

- I/O

I/O

- I/O

I/O

Control

I/O

Control

13L(1)

CLK

ADS

CNTEN

CNTRST

Counter/

Address

Reg.

MEMORY

ARRAY

Counter/

Address

Reg.

13R(1)

CLK

ADS

CNTEN

CNTRST

5653 drw 01

NOTE:

1. A

is a NC for IDT709159.

JANUARY 2009

DSC-5653/3

709159L9PF Related Products

	709159L9PF	709159L9BF	709159L6BF
Description	SRAM 8K X 9 DP SRAM	SRAM 8K x 9 Sync, Dual-Port RAM, Pipelined/Flow-Through	SRAM 8K x 9 Sync, Dual-Port RAM, Pipelined/Flow-Through
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible
Parts packaging code	TQFP	CABGA	CABGA
package instruction	14 X 14 MM, 1.4 MM HEIGHT, TQFP-100	10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100	10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100
Contacts	100	100	100
Manufacturer packaging code	PN100	BF100	BF100
Reach Compliance Code	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99
Maximum access time	9 ns	9 ns	6.5 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	66 MHz	66 MHz	100 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	S-PQFP-G100	S-PBGA-B100	S-PBGA-B100
JESD-609 code	e0	e0	e0
length	14 mm	10 mm	10 mm
memory density	73728 bit	73728 bit	73728 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	9	9	9
Humidity sensitivity level	3	3	3
Number of functions	1	1	1
Number of ports	2	2	2
Number of terminals	100	100	100
word count	8192 words	8192 words	8192 words
character code	8000	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	8KX9	8KX9	8KX9
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFBGA	LFBGA
Encapsulate equivalent code	QFP100,.63SQ,20	BGA100,10X10,32	BGA100,10X10,32
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	225	225
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.4 mm	1.4 mm
Maximum standby current	0.003 A	0.003 A	0.003 A
Minimum standby current	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.36 mA	0.36 mA	0.43 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	GULL WING	BALL	BALL
Terminal pitch	0.5 mm	0.8 mm	0.8 mm
Terminal location	QUAD	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	10 mm	10 mm
Base Number Matches	1	1	1
Maker	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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