EEWORLDEEWORLDEEWORLD

Part Number

Search

IDT7188S70DB

Description
Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Categorystorage   
File Size69KB,7 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT7188S70DB Overview

Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

IDT7188S70DB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeDIP
package instruction0.300 INCH, CERAMIC, DIP-22
Contacts22
Reach Compliance Codenot_compliant
ECCN code3A001.A.2.C
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T22
JESD-609 codee0
length27.051 mm
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals22
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16KX4
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP22,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height5.08 mm
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width7.62 mm
Base Number Matches1
CMOS STATIC RAM
64K (16K x 4-BIT)
Integrated Device Technology, Inc.
IDT7188S
IDT7188L
FEATURES:
• High-speed (equal access and cycle times)
— Military: 25/35/45/55/70/85ns (max.)
• Low power consumption
• Battery backup operation — 2V data retention (L version
only)
• Available in high-density industry standard 22-pin, 300
mil ceramic DIP
• Produced with advanced CMOS technology
• Inputs/outputs TTL-compatible
• Military product compliant to MIL-STD-883, Class B
DESCRIPTION:
The IDT7188 is a 65,536-bit high-speed static RAM
organized as 16K x 4. It is fabricated using IDT’s high-
performance, high-reliability technology — CMOS. This state-
of-the-art technology, combined with innovative circuit design
techniques, provides a cost effective approach for memory
intensive applications.
Access times as fast as 25ns are available. The IDT7188
offers a reduced power standby mode, I
SB1
, which is activated
when
CS
goes HIGH. This capability significantly decreases
power while enhancing system reliability. The low-power
version (L) version also offers a battery backup data retention
capability where the circuit typically consumes only 30µW
operating from a 2V battery.
All inputs and outputs are TTL-compatible and operate
from a single 5V supply. The IDT7188 is packaged in 22-pin,
300 mil ceramic DIP providing excellent board-level packing
densities.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B, making it ideally
suited to military temperature applications demanding the
highest level of performance and reliability.
FUNCTIONAL BLOCK DIAGRAM
A
0
V
CC
GND
65,536-BIT
MEMORY ARRAY
DECODER
A
13
I/O
0
I/O
1
I/O
2
I/O
3
COLUMN I/O
INPUT
DATA
CONTROL
CS
WE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
2989 drw 01
MILITARY TEMPERATURE RANGE
©1996
Integrated Device Technology, Inc.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
AUGUST 1996
6.3
DSC-2989/7
1

IDT7188S70DB Related Products

IDT7188S70DB IDT7188L35DB IDT7188S45DB IDT7188S55DB IDT7188L55DB
Description Standard SRAM, 16KX4, 70ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP DIP
package instruction 0.300 INCH, CERAMIC, DIP-22 0.300 INCH, CERAMIC, DIP-22 DIP, DIP22,.3 DIP, DIP22,.3 DIP, DIP22,.3
Contacts 22 22 22 22 22
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
Maximum access time 70 ns 35 ns - 55 ns 55 ns
I/O type COMMON COMMON - COMMON COMMON
JESD-30 code R-GDIP-T22 R-GDIP-T22 - R-GDIP-T22 R-GDIP-T22
JESD-609 code e0 e0 - e0 e0
length 27.051 mm 27.051 mm - 27.051 mm 27.051 mm
memory density 65536 bit 65536 bit - 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM
memory width 4 4 - 4 4
Number of functions 1 1 - 1 1
Number of ports 1 1 - 1 1
Number of terminals 22 22 - 22 22
word count 16384 words 16384 words - 16384 words 16384 words
character code 16000 16000 - 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C - -55 °C -55 °C
organize 16KX4 16KX4 - 16KX4 16KX4
Output characteristics 3-STATE 3-STATE - 3-STATE 3-STATE
Exportable NO NO - NO NO
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP - DIP DIP
Encapsulate equivalent code DIP22,.3 DIP22,.3 - DIP22,.3 DIP22,.3
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE - IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 - 225 225
power supply 5 V 5 V - 5 V 5 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Filter level MIL-STD-883 Class B MIL-STD-883 Class B - MIL-STD-883 Class B MIL-STD-883 Class B
Maximum seat height 5.08 mm 5.08 mm - 5.08 mm 5.08 mm
Maximum standby current 0.02 A 0.0006 A - 0.02 A 0.0006 A
Minimum standby current 4.5 V 2 V - 4.5 V 2 V
Maximum slew rate 0.14 mA 0.115 mA - 0.14 mA 0.11 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V
surface mount NO NO - NO NO
technology CMOS CMOS - CMOS CMOS
Temperature level MILITARY MILITARY - MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm - 2.54 mm 2.54 mm
Terminal location DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature 20 20 - 20 20
width 7.62 mm 7.62 mm - 7.62 mm 7.62 mm
Base Number Matches 1 1 1 1 -
Online Dictionary: IC Integrated Circuit
Online Dictionary: IC Integrated Circuit Glossary "IC Integrated Circuit":   IC (Integrated Circuit) is the integration of electronic components such as transistors, resistors, capacitors, diodes, etc...
fighting Analog electronics
Analysis of several reasons that lead to serious functional abnormalities in MCU
When we are engaged in MCU application development, we will inevitably encounter MCU chip abnormalities. For example, abnormal reset, which is manifested by the reset pin having a level jump or simply...
fish001 Microcontroller MCU
H3LIS331DL three-axis acceleration sensor package and code
[i=s]This post was last edited by littleshrimp on 2018-10-24 10:07[/i] Data sheet:Code:Package:Official evaluation board gerber file:...
littleshrimp MEMS sensors
Optimization of embedded system design based on MCU
MCUs are required to control an increasing number of functions in embedded systems. These functions are often real-time and require regular maintenance to meet system requirements for responsiveness, ...
fish001 Microcontroller MCU
General Problems of Power Amplifier Circuits
The direct purpose of the power amplifier is to obtain output power. One of its basic problems is how much signal power can be output under certain power supply conditions . Since the power amplifier ...
fighting Analog electronics
Build a laser tripwire alarm using the MSP430 LaunchPad
We will show you how to use the ADC module of the MSP430 LaunchPad and build a sample application in the Energia IDE. The features of the ADC module in the MSP430 LaunchPad development board include: ...
Aguilera Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号