Standard SRAM, 2KX8, 120ns, CMOS, CDIP24, CERAMIC, DIP-24
Parameter Name | Attribute value |
Maker | Harris |
package instruction | DIP, |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 120 ns |
Other features | TTL COMPATIBLE |
JESD-30 code | R-GDIP-T24 |
memory density | 16384 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2KX8 |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 5.72 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Base Number Matches | 1 |
8403607JA | 8403607JX | |
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Description | Standard SRAM, 2KX8, 120ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 120ns, CMOS, CDIP24, CERAMIC, DIP-24 |
Maker | Harris | Harris |
package instruction | DIP, | DIP, |
Reach Compliance Code | unknown | unknown |
ECCN code | 3A001.A.2.C | 3A001.A.2.C |
Maximum access time | 120 ns | 120 ns |
Other features | TTL COMPATIBLE | TTL COMPATIBLE |
JESD-30 code | R-GDIP-T24 | R-GDIP-T24 |
memory density | 16384 bit | 16384 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 24 | 24 |
word count | 2048 words | 2048 words |
character code | 2000 | 2000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
organize | 2KX8 | 2KX8 |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 5.72 mm | 5.72 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
width | 15.24 mm | 15.24 mm |
Base Number Matches | 1 | 1 |