P0404FC3.3C datasheet, PDF - EEWORLD Datasheet

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P0404FC3.3C: Description250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE; CategoryDiscrete semiconductor diode; File Size75KB，6 Pages; ManufacturerProTek Devices; Websitehttp://www.protekdevices.com/

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P0404FC3.3C Overview

250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE

P0404FC3.3C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	FLIP-CHIP
package instruction	S-XBGA-B4
Contacts	4
Reach Compliance Code	compli
ECCN code	EAR99
Other features	LOW LEAKAGE CURRENT
Minimum breakdown voltage	4 V
Maximum clamping voltage	12.5 V
Configuration	COMMON CATHODE, 4 ELEMENTS
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	S-XBGA-B4
JESD-609 code	e0
Humidity sensitivity level	1
Maximum non-repetitive peak reverse power dissipation	250 W
Number of components	4
Number of terminals	4
Package body material	UNSPECIFIED
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	245
polarity	BIDIRECTIONAL
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	3.3 V
surface mount	YES
technology	AVALANCHE
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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05154

P0404FC3.3C*

thru

P0404FC36C*

PFLIP CHIP ARRAY

APPLICATIONS

✔

Cellular Phones

✔

MCM Boards

✔

Wireless Communication Circuits

✔

IR LEDs

✔

SMART & PCMCIA Cards

IEC COMPATIBILITY

(EN61000-4)

✔

61000-4-2 (ESD): Air - 15kV, Contact - 8kV

✔

61000-4-4 (EFT): 40A - 5/50ns

0402 CHIP SHOWN

FEATURES

✔

ESD Protection > 25 kilovolts

✔

Available in Voltages Ranging From 3.3V to 36V

✔

250 Watts Peak Pulse Power per Line (tp = 8/20µs)

✔

Bidirectional Configuration & Monolithic Structure

✔

Protects 1 to 3 Lines

✔

RoHS Compliant

MECHANICAL CHARACTERISTICS

✔

Standard EIA Chip Size: 0404

✔

Weight 0.73 milligrams (Approximate)

✔

Available in Lead-Free Plating

✔

Solder Reflow Temperature:

Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C

✔

Consult Factory for Leaded Device Availability

✔

Flammability Rating UL 94V-0

✔

8mm Plastic & Paper Tape and Reel Per EIA Standard 481

✔

Device Marking On Reel

✔

Top Contacts: Solder Bump 0.004” in Height (Nominal)

PIN CONFIGURATION

05154.R6 2/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”

P0404FC3.3C Related Products

	P0404FC3.3C	P0404FC05C	P0404FC12C	P0404FC08C	P0404FC36C	P0404FC24C	P0404FC15C
Description	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE	250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible
Parts packaging code	FLIP-CHIP	FLIP-CHIP	FLIP-CHIP	FLIP-CHIP	-	FLIP-CHIP	FLIP-CHIP
package instruction	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	-	S-XBGA-B4	S-XBGA-B4
Contacts	4	4	4	4	-	4	4
Reach Compliance Code	compli	compli	compli	compliant	-	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	-	EAR99	EAR99
Other features	LOW LEAKAGE CURRENT	LOW LEAKAGE CURRENT	LOW LEAKAGE CURRENT	LOW LEAKAGE CURRENT	-	LOW LEAKAGE CURRENT	LOW LEAKAGE CURRENT
Minimum breakdown voltage	4 V	6 V	13.3 V	8.5 V	-	26.7 V	16.7 V
Maximum clamping voltage	12.5 V	14.7 V	29.7 V	19.2 V	-	55 V	35.7 V
Configuration	COMMON CATHODE, 4 ELEMENTS	COMMON CATHODE, 4 ELEMENTS	COMMON CATHODE, 4 ELEMENTS	COMMON CATHODE, 4 ELEMENTS	-	COMMON CATHODE, 4 ELEMENTS	COMMON CATHODE, 4 ELEMENTS
Diode component materials	SILICON	SILICON	SILICON	SILICON	-	SILICON	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	-	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	S-XBGA-B4	-	S-XBGA-B4	S-XBGA-B4
JESD-609 code	e0	e0	e0	e0	-	e0	e0
Humidity sensitivity level	1	1	1	1	-	1	1
Maximum non-repetitive peak reverse power dissipation	250 W	250 W	250 W	250 W	-	250 W	250 W
Number of components	4	4	4	4	-	4	4
Number of terminals	4	4	4	4	-	4	4
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	-	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	245	245	245	245	-	245	245
polarity	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	-	BIDIRECTIONAL	BIDIRECTIONAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum repetitive peak reverse voltage	3.3 V	5 V	12 V	8 V	-	24 V	15 V
surface mount	YES	YES	YES	YES	-	YES	YES
technology	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE	-	AVALANCHE	AVALANCHE
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	-	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
Maker	-	ProTek Devices	ProTek Devices	ProTek Devices	-	ProTek Devices	ProTek Devices

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