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P0404FC36C

Description
250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
Categorysemiconductor    Discrete semiconductor   
File Size75KB,6 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
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P0404FC36C Overview

250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE

05154
P0404FC3.3C*
thru
P0404FC36C*
PFLIP CHIP ARRAY
APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPATIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
0402 CHIP SHOWN
FEATURES
ESD Protection > 25 kilovolts
Available in Voltages Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional Configuration & Monolithic Structure
Protects 1 to 3 Lines
RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0404
Weight 0.73 milligrams (Approximate)
Available in Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Consult Factory for Leaded Device Availability
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
05154.R6 2/07
1
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”

P0404FC36C Related Products

P0404FC36C P0404FC05C P0404FC12C P0404FC08C P0404FC3.3C P0404FC24C P0404FC15C
Description 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible
Maker - ProTek Devices ProTek Devices ProTek Devices - ProTek Devices ProTek Devices
Parts packaging code - FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
package instruction - S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4
Contacts - 4 4 4 4 4 4
Reach Compliance Code - compli compli compliant compli compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features - LOW LEAKAGE CURRENT LOW LEAKAGE CURRENT LOW LEAKAGE CURRENT LOW LEAKAGE CURRENT LOW LEAKAGE CURRENT LOW LEAKAGE CURRENT
Minimum breakdown voltage - 6 V 13.3 V 8.5 V 4 V 26.7 V 16.7 V
Maximum clamping voltage - 14.7 V 29.7 V 19.2 V 12.5 V 55 V 35.7 V
Configuration - COMMON CATHODE, 4 ELEMENTS COMMON CATHODE, 4 ELEMENTS COMMON CATHODE, 4 ELEMENTS COMMON CATHODE, 4 ELEMENTS COMMON CATHODE, 4 ELEMENTS COMMON CATHODE, 4 ELEMENTS
Diode component materials - SILICON SILICON SILICON SILICON SILICON SILICON
Diode type - TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code - S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4 S-XBGA-B4
JESD-609 code - e0 e0 e0 e0 e0 e0
Humidity sensitivity level - 1 1 1 1 1 1
Maximum non-repetitive peak reverse power dissipation - 250 W 250 W 250 W 250 W 250 W 250 W
Number of components - 4 4 4 4 4 4
Number of terminals - 4 4 4 4 4 4
Package body material - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) - 245 245 245 245 245 245
polarity - BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum repetitive peak reverse voltage - 5 V 12 V 8 V 3.3 V 24 V 15 V
surface mount - YES YES YES YES YES YES
technology - AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
Terminal surface - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form - BALL BALL BALL BALL BALL BALL
Terminal location - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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