Audio Amplifiers Integrated Circuits (ICs)
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFN |
| package instruction | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Commercial integrated circuit types | VOLUME CONTROL CIRCUIT |
| JESD-30 code | S-XQCC-N28 |
| JESD-609 code | e0 |
| length | 5 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 245 |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| Base Number Matches | 1 |
| MAX9750AETI-T | MAX9750AETI- | MAX9755ETI-T | MAX9750BETI- | MAX9755ETI- | MAX9750BETI | MAX9751ETI-T | MAX9750BETI-T | |
|---|---|---|---|---|---|---|---|---|
| Description | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers |
| Is it Rohs certified? | incompatible | - | incompatible | - | - | incompatible | incompatible | incompatible |
| Parts packaging code | QFN | - | QFN | - | - | QFN | QFN | QFN |
| package instruction | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | - | HVQCCN, LCC28,.2SQ,20 | - | - | HVQCCN, LCC28,.2SQ,20 | HVQCCN, LCC28,.2SQ,20 | HVQCCN, LCC28,.2SQ,20 |
| Contacts | 28 | - | 28 | - | - | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | - | not_compliant | - | - | not_compliant | not_compliant | not_compliant |
| Commercial integrated circuit types | VOLUME CONTROL CIRCUIT | - | AUDIO AMPLIFIER | - | - | VOLUME CONTROL CIRCUIT | AUDIO AMPLIFIER | VOLUME CONTROL CIRCUIT |
| JESD-30 code | S-XQCC-N28 | - | S-XQCC-N28 | - | - | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
| JESD-609 code | e0 | - | e0 | - | - | e0 | e0 | e0 |
| length | 5 mm | - | 5 mm | - | - | 5 mm | 5 mm | 5 mm |
| Number of functions | 1 | - | 1 | - | - | 1 | 1 | 1 |
| Number of terminals | 28 | - | 28 | - | - | 28 | 28 | 28 |
| Maximum operating temperature | 85 °C | - | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| Package body material | UNSPECIFIED | - | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | - | HVQCCN | - | - | HVQCCN | HVQCCN | HVQCCN |
| Package shape | SQUARE | - | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 245 | - | 245 | - | - | 240 | NOT SPECIFIED | 240 |
| Certification status | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.8 mm | - | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V |
| surface mount | YES | - | YES | - | - | YES | YES | YES |
| technology | BICMOS | - | BICMOS | - | - | BICMOS | BICMOS | BICMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | - | NO LEAD | - | - | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 0.5 mm | - | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | - | QUAD | - | - | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 5 mm | - | 5 mm | - | - | 5 mm | 5 mm | 5 mm |
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