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IS62WV5128BLL-55HLI

Description
SRAM 4Mb 512Kx8 55ns Async SRAM
Categorystorage    storage   
File Size464KB,17 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Environmental Compliance
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IS62WV5128BLL-55HLI Overview

SRAM 4Mb 512Kx8 55ns Async SRAM

IS62WV5128BLL-55HLI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeTSOP1
package instructionTSOP1, TSSOP32,.56,20
Contacts32
Reach Compliance Codecompliant
ECCN code3A991
Factory Lead Time8 weeks
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee3
length11.8 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP32,.56,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.25 mm
Maximum standby current0.000015 A
Minimum standby current1.2 V
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width8 mm
Base Number Matches1

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Description SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4M (512Kx8) 55ns Async SRAM
Is it lead-free? Lead free - Lead free Lead free - Lead free
Is it Rohs certified? conform to - conform to conform to - conform to
Parts packaging code TSOP1 - TSOP1 BGA - SOIC
package instruction TSOP1, TSSOP32,.56,20 - TSOP1, TFBGA, BGA36,6X8,30 - SOP, SOP32,.56
Reach Compliance Code compliant - compliant compliant - compliant
ECCN code 3A991 - 3A991.B.2.A 3A991.B.2.A - 3A991
Factory Lead Time 8 weeks - 8 weeks 8 weeks - 8 weeks
Maximum access time 55 ns - 55 ns 55 ns - 55 ns
JESD-30 code R-PDSO-G32 - R-PDSO-G32 R-PBGA-B36 - R-PDSO-G32
JESD-609 code e3 - e3 e1 - e3
length 11.8 mm - 11.8 mm 8 mm - 20.445 mm
memory density 4194304 bit - 4194304 bit 4194304 bit - 4194304 bit
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM - STANDARD SRAM
memory width 8 - 8 8 - 8
Humidity sensitivity level 3 - 3 3 - 3
Number of functions 1 - 1 1 - 1
Number of terminals 32 - 32 36 - 32
word count 524288 words - 524288 words 524288 words - 524288 words
character code 512000 - 512000 512000 - 512000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C - 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C - -40 °C
organize 512KX8 - 512KX8 512KX8 - 512KX8
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSOP1 - TSOP1 TFBGA - SOP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH - SMALL OUTLINE
Parallel/Serial PARALLEL - PARALLEL PARALLEL - PARALLEL
Peak Reflow Temperature (Celsius) 260 - 260 260 - 260
Certification status Not Qualified - Not Qualified Not Qualified - Not Qualified
Maximum seat height 1.25 mm - 1.25 mm 1.2 mm - 3 mm
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V - 3.6 V
Minimum supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V - 2.5 V
Nominal supply voltage (Vsup) 2.8 V - 2.8 V 2.8 V - 2.8 V
surface mount YES - YES YES - YES
technology CMOS - CMOS CMOS - CMOS
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL - INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed - Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) - Matte Tin (Sn) - annealed
Terminal form GULL WING - GULL WING BALL - GULL WING
Terminal pitch 0.5 mm - 0.5 mm 0.75 mm - 1.27 mm
Terminal location DUAL - DUAL BOTTOM - DUAL
Maximum time at peak reflow temperature 40 - 40 40 - 40
width 8 mm - 8 mm 6 mm - 11.305 mm
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