|
IS62WV5128BLL-55TLI-TR |
IS62WV5128BLL-55HLI |
IS62WV5128BLL-55BLI-TR |
IS62WV5128BLL-55HLI-TR |
IS62WV5128BLL-55BLI |
IS62WV5128BLL-55QLI |
Description |
SRAM 4Mb 512Kx8 55ns Async SRAM |
SRAM 4Mb 512Kx8 55ns Async SRAM |
SRAM 4Mb 512Kx8 55ns Async SRAM |
SRAM 4Mb 512Kx8 55ns Async SRAM |
SRAM 4Mb 512Kx8 55ns Async SRAM |
SRAM 4M (512Kx8) 55ns Async SRAM |
Is it lead-free? |
- |
Lead free |
- |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
- |
conform to |
- |
conform to |
conform to |
conform to |
Parts packaging code |
- |
TSOP1 |
- |
TSOP1 |
BGA |
SOIC |
package instruction |
- |
TSOP1, TSSOP32,.56,20 |
- |
TSOP1, |
TFBGA, BGA36,6X8,30 |
SOP, SOP32,.56 |
Reach Compliance Code |
- |
compliant |
- |
compliant |
compliant |
compliant |
ECCN code |
- |
3A991 |
- |
3A991.B.2.A |
3A991.B.2.A |
3A991 |
Factory Lead Time |
- |
8 weeks |
- |
8 weeks |
8 weeks |
8 weeks |
Maximum access time |
- |
55 ns |
- |
55 ns |
55 ns |
55 ns |
JESD-30 code |
- |
R-PDSO-G32 |
- |
R-PDSO-G32 |
R-PBGA-B36 |
R-PDSO-G32 |
JESD-609 code |
- |
e3 |
- |
e3 |
e1 |
e3 |
length |
- |
11.8 mm |
- |
11.8 mm |
8 mm |
20.445 mm |
memory density |
- |
4194304 bit |
- |
4194304 bit |
4194304 bit |
4194304 bit |
Memory IC Type |
- |
STANDARD SRAM |
- |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
memory width |
- |
8 |
- |
8 |
8 |
8 |
Humidity sensitivity level |
- |
3 |
- |
3 |
3 |
3 |
Number of functions |
- |
1 |
- |
1 |
1 |
1 |
Number of terminals |
- |
32 |
- |
32 |
36 |
32 |
word count |
- |
524288 words |
- |
524288 words |
524288 words |
524288 words |
character code |
- |
512000 |
- |
512000 |
512000 |
512000 |
Operating mode |
- |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
- |
85 °C |
- |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
organize |
- |
512KX8 |
- |
512KX8 |
512KX8 |
512KX8 |
Package body material |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
TSOP1 |
- |
TSOP1 |
TFBGA |
SOP |
Package shape |
- |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE, THIN PROFILE |
- |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
SMALL OUTLINE |
Parallel/Serial |
- |
PARALLEL |
- |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
- |
260 |
- |
260 |
260 |
260 |
Certification status |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
- |
1.25 mm |
- |
1.25 mm |
1.2 mm |
3 mm |
Maximum supply voltage (Vsup) |
- |
3.6 V |
- |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
- |
2.5 V |
- |
2.5 V |
2.5 V |
2.5 V |
Nominal supply voltage (Vsup) |
- |
2.8 V |
- |
2.8 V |
2.8 V |
2.8 V |
surface mount |
- |
YES |
- |
YES |
YES |
YES |
technology |
- |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
- |
Matte Tin (Sn) - annealed |
- |
Matte Tin (Sn) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) - annealed |
Terminal form |
- |
GULL WING |
- |
GULL WING |
BALL |
GULL WING |
Terminal pitch |
- |
0.5 mm |
- |
0.5 mm |
0.75 mm |
1.27 mm |
Terminal location |
- |
DUAL |
- |
DUAL |
BOTTOM |
DUAL |
Maximum time at peak reflow temperature |
- |
40 |
- |
40 |
40 |
40 |
width |
- |
8 mm |
- |
8 mm |
6 mm |
11.305 mm |