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IS62WV5128BLL-55TLI-TR

Description
SRAM 4Mb 512Kx8 55ns Async SRAM
Categorystorage   
File Size464KB,17 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Environmental Compliance
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IS62WV5128BLL-55TLI-TR Overview

SRAM 4Mb 512Kx8 55ns Async SRAM

IS62WV5128BLL-55TLI-TR Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerISSI(Integrated Silicon Solution Inc.)
Product CategorySRAM
RoHSDetails
Memory Size4 Mbit
Organization512 k x 8
Access Time55 ns
Interface TypeParallel
Supply Voltage - Max3.6 V
Supply Voltage - Min2.5 V
Supply Current - Max15 mA
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT
Package / CaseTSOP-32
PackagingReel
Data RateSDR
TypeAsynchronous
Number of Ports1
Moisture SensitiveYes
Factory Pack Quantity1500

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Description SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4Mb 512Kx8 55ns Async SRAM SRAM 4M (512Kx8) 55ns Async SRAM
Is it lead-free? - Lead free - Lead free Lead free Lead free
Is it Rohs certified? - conform to - conform to conform to conform to
Parts packaging code - TSOP1 - TSOP1 BGA SOIC
package instruction - TSOP1, TSSOP32,.56,20 - TSOP1, TFBGA, BGA36,6X8,30 SOP, SOP32,.56
Reach Compliance Code - compliant - compliant compliant compliant
ECCN code - 3A991 - 3A991.B.2.A 3A991.B.2.A 3A991
Factory Lead Time - 8 weeks - 8 weeks 8 weeks 8 weeks
Maximum access time - 55 ns - 55 ns 55 ns 55 ns
JESD-30 code - R-PDSO-G32 - R-PDSO-G32 R-PBGA-B36 R-PDSO-G32
JESD-609 code - e3 - e3 e1 e3
length - 11.8 mm - 11.8 mm 8 mm 20.445 mm
memory density - 4194304 bit - 4194304 bit 4194304 bit 4194304 bit
Memory IC Type - STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width - 8 - 8 8 8
Humidity sensitivity level - 3 - 3 3 3
Number of functions - 1 - 1 1 1
Number of terminals - 32 - 32 36 32
word count - 524288 words - 524288 words 524288 words 524288 words
character code - 512000 - 512000 512000 512000
Operating mode - ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 85 °C - 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C -40 °C
organize - 512KX8 - 512KX8 512KX8 512KX8
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - TSOP1 - TSOP1 TFBGA SOP
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE
Parallel/Serial - PARALLEL - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - 260 - 260 260 260
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.25 mm - 1.25 mm 1.2 mm 3 mm
Maximum supply voltage (Vsup) - 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 2.5 V - 2.5 V 2.5 V 2.5 V
Nominal supply voltage (Vsup) - 2.8 V - 2.8 V 2.8 V 2.8 V
surface mount - YES - YES YES YES
technology - CMOS - CMOS CMOS CMOS
Temperature level - INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Matte Tin (Sn) - annealed - Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed
Terminal form - GULL WING - GULL WING BALL GULL WING
Terminal pitch - 0.5 mm - 0.5 mm 0.75 mm 1.27 mm
Terminal location - DUAL - DUAL BOTTOM DUAL
Maximum time at peak reflow temperature - 40 - 40 40 40
width - 8 mm - 8 mm 6 mm 11.305 mm

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