IS62WV5128BLL-55QLI datasheet, PDF

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IS62WV5128BLL-55QLI: DescriptionSRAM 4M (512Kx8) 55ns Async SRAM; Categorystorage storage; File Size464KB，17 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/; Environmental Compliance

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IS62WV5128BLL-55QLI Overview

SRAM 4M (512Kx8) 55ns Async SRAM

IS62WV5128BLL-55QLI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	SOP, SOP32,.56
Reach Compliance Code	compliant
ECCN code	3A991
Factory Lead Time	8 weeks
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
length	20.445 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP32,.56
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	3 mm
Maximum standby current	0.000015 A
Minimum standby current	1.2 V
Maximum slew rate	0.045 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	11.305 mm
Base Number Matches	1

IS62WV5128BLL-55QLI Related Products

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Description	SRAM 4M (512Kx8) 55ns Async SRAM	SRAM 4Mb 512Kx8 55ns Async SRAM	SRAM 4Mb 512Kx8 55ns Async SRAM	SRAM 4Mb 512Kx8 55ns Async SRAM	SRAM 4Mb 512Kx8 55ns Async SRAM	SRAM 4Mb 512Kx8 55ns Async SRAM
Is it lead-free?	Lead free	Lead free	-	Lead free	Lead free	-
Is it Rohs certified?	conform to	conform to	-	conform to	conform to	-
Parts packaging code	SOIC	TSOP1	-	TSOP1	BGA	-
package instruction	SOP, SOP32,.56	TSOP1, TSSOP32,.56,20	-	TSOP1,	TFBGA, BGA36,6X8,30	-
Reach Compliance Code	compliant	compliant	-	compliant	compliant	-
ECCN code	3A991	3A991	-	3A991.B.2.A	3A991.B.2.A	-
Factory Lead Time	8 weeks	8 weeks	-	8 weeks	8 weeks	-
Maximum access time	55 ns	55 ns	-	55 ns	55 ns	-
JESD-30 code	R-PDSO-G32	R-PDSO-G32	-	R-PDSO-G32	R-PBGA-B36	-
JESD-609 code	e3	e3	-	e3	e1	-
length	20.445 mm	11.8 mm	-	11.8 mm	8 mm	-
memory density	4194304 bit	4194304 bit	-	4194304 bit	4194304 bit	-
Memory IC Type	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	-
memory width	8	8	-	8	8	-
Humidity sensitivity level	3	3	-	3	3	-
Number of functions	1	1	-	1	1	-
Number of terminals	32	32	-	32	36	-
word count	524288 words	524288 words	-	524288 words	524288 words	-
character code	512000	512000	-	512000	512000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-
organize	512KX8	512KX8	-	512KX8	512KX8	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SOP	TSOP1	-	TSOP1	TFBGA	-
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Parallel/Serial	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	260	260	-	260	260	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-
Maximum seat height	3 mm	1.25 mm	-	1.25 mm	1.2 mm	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	-	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	2.5 V	2.5 V	-	2.5 V	2.5 V	-
Nominal supply voltage (Vsup)	2.8 V	2.8 V	-	2.8 V	2.8 V	-
surface mount	YES	YES	-	YES	YES	-
technology	CMOS	CMOS	-	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	-	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	-
Terminal form	GULL WING	GULL WING	-	GULL WING	BALL	-
Terminal pitch	1.27 mm	0.5 mm	-	0.5 mm	0.75 mm	-
Terminal location	DUAL	DUAL	-	DUAL	BOTTOM	-
Maximum time at peak reflow temperature	40	40	-	40	40	-
width	11.305 mm	8 mm	-	8 mm	6 mm	-

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