MC9S08QE8CWL datasheet, PDF - EEWORLD Datasheet

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MC9S08QE8CWL: Description8-bit Microcontrollers - MCU 8KB FLASH; 512 RAM; CategoryThe embedded processor and controller Microcontrollers and processors; File Size966KB，54 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC9S08QE8CWL Overview

8-bit Microcontrollers - MCU 8KB FLASH; 512 RAM

MC9S08QE8CWL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	ROHS COMPLIANT, MS-013AE, SOIC-28
Contacts	28
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Has ADC	YES
Address bus width
bit size	8
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDSO-G28
JESD-609 code	e3
length	17.95 mm
Humidity sensitivity level	3
Number of I/O lines	24
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
power supply	1.8/3.6 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	8192
ROM programmability	FLASH
Maximum seat height	2.65 mm
speed	20 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	ROHS COMPLIANT, MS-013AE, SOIC-28	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	ROHS COMPLIANT, MS-013AE, SOIC-28	7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32	LQFP, QFP32,.35SQ,32	7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32	4 X 4 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-32
Reach Compliance Code	unknown	compliant	unknown	unknown	unknown	compliant	unknown	unknown
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	EAR99
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES
bit size	8	8	8	8	8	8	8	8
maximum clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	R-PDSO-G28	R-PDSO-G16	R-PDSO-G16	R-PDSO-G28	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32	S-XQCC-N32
length	17.95 mm	5 mm	5 mm	17.925 mm	7 mm	7 mm	7 mm	4 mm
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of I/O lines	24	14	14	24	28	28	28	28
Number of terminals	28	16	16	28	32	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	SOP	TSSOP	TSSOP	SOP	LQFP	LQFP	LQFP	HVQCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	2.65 mm	1.2 mm	1.2 mm	2.65 mm	1.4 mm	1.6 mm	1.6 mm	1 mm
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD
Terminal pitch	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.8 mm	0.8 mm	0.8 mm	0.4 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40
width	7.5 mm	4.4 mm	4.4 mm	7.5 mm	7 mm	7 mm	7 mm	4 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free
Parts packaging code	SOIC	-	TSSOP	SOIC	QFP	-	QFP	QFN
Contacts	28	-	16	28	32	-	32	32
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	-
Encapsulate equivalent code	SOP28,.4	-	TSSOP16,.25	SOP28,.4	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32	LCC32,.16SQ,16
power supply	1.8/3.6 V	-	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	512	-	256	256	512	256	256	512
rom(word)	8192	-	4096	4096	8192	4096	4096	8192
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-
Base Number Matches	1	1	1	1	-	1	1	-
Brand Name	-	Freescale	Freescale	Freescale	Freescale	-	-	Freescale

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