8-bit Microcontrollers - MCU 8 BIT 8K FLASH
| Parameter Name | Attribute value |
| Brand Name | Freescale |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | QFP |
| package instruction | 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.A.2 |
| Samacsys Description | Microcontrollers |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| maximum clock frequency | 16 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | S-PQFP-G32 |
| JESD-609 code | e3 |
| length | 7 mm |
| Humidity sensitivity level | 3 |
| Number of I/O lines | 28 |
| Number of terminals | 32 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP32,.35SQ,32 |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8/3.6 V |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| rom(word) | 8192 |
| ROM programmability | FLASH |
| Maximum seat height | 1.4 mm |
| speed | 20 MHz |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 7 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC9S08QE8CLC | MC9S08QE8CWL | MC9S08QE4CTGR | MC9S08QE4CTG | MC9S08QE4CWL | MC9S08QE4CLCR | MC9S08QE4CLC | MC9S08QE8CFM | |
|---|---|---|---|---|---|---|---|---|
| Description | 8-bit Microcontrollers - MCU 8 BIT 8K FLASH | 8-bit Microcontrollers - MCU 8KB FLASH; 512 RAM | 8-bit Microcontrollers - MCU 4K Flash, 256 Ram | 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM | 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM | 8-bit Microcontrollers - MCU 4KB Flash, 512 Ram | 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM | 8-bit Microcontrollers - MCU 8BIT 8K FLASH |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| package instruction | 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 | ROHS COMPLIANT, MS-013AE, SOIC-28 | 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16 | 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16 | ROHS COMPLIANT, MS-013AE, SOIC-28 | LQFP, QFP32,.35SQ,32 | 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 | 4 X 4 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-32 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | compliant | unknown | unknown |
| ECCN code | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | EAR99 |
| Has ADC | YES | YES | YES | YES | YES | YES | YES | YES |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 code | S-PQFP-G32 | R-PDSO-G28 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G28 | S-PQFP-G32 | S-PQFP-G32 | S-XQCC-N32 |
| length | 7 mm | 17.95 mm | 5 mm | 5 mm | 17.925 mm | 7 mm | 7 mm | 4 mm |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of I/O lines | 28 | 24 | 14 | 14 | 24 | 28 | 28 | 28 |
| Number of terminals | 32 | 28 | 16 | 16 | 28 | 32 | 32 | 32 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM channel | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| encapsulated code | LQFP | SOP | TSSOP | TSSOP | SOP | LQFP | LQFP | HVQCCN |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| Maximum seat height | 1.4 mm | 2.65 mm | 1.2 mm | 1.2 mm | 2.65 mm | 1.6 mm | 1.6 mm | 1 mm |
| speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Maximum supply voltage | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| Terminal pitch | 0.8 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.4 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| width | 7 mm | 7.5 mm | 4.4 mm | 4.4 mm | 7.5 mm | 7 mm | 7 mm | 4 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Brand Name | Freescale | - | Freescale | Freescale | Freescale | - | - | Freescale |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | - | Lead free | Lead free |
| Parts packaging code | QFP | SOIC | - | TSSOP | SOIC | - | QFP | QFN |
| Contacts | 32 | 28 | - | 16 | 28 | - | 32 | 32 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 | - |
| Encapsulate equivalent code | QFP32,.35SQ,32 | SOP28,.4 | - | TSSOP16,.25 | SOP28,.4 | QFP32,.35SQ,32 | QFP32,.35SQ,32 | LCC32,.16SQ,16 |
| power supply | 1.8/3.6 V | 1.8/3.6 V | - | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V | 1.8/3.6 V |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 512 | 512 | - | 256 | 256 | 256 | 256 | 512 |
| rom(word) | 8192 | 8192 | - | 4096 | 4096 | 4096 | 4096 | 8192 |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
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