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MC9S08QE4CLC

Description
8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size966KB,54 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MC9S08QE4CLC Overview

8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM

MC9S08QE4CLC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeQFP
package instruction7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.A.2
Has ADCYES
Address bus width
bit size8
maximum clock frequency16 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G32
JESD-609 codee3
length7 mm
Humidity sensitivity level3
Number of I/O lines28
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1.8/3.6 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)4096
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed20 MHz
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1

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Description 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM 8-bit Microcontrollers - MCU 8KB FLASH; 512 RAM 8-bit Microcontrollers - MCU 4K Flash, 256 Ram 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM 8-bit Microcontrollers - MCU 4KB FLASH; 512 RAM 8-bit Microcontrollers - MCU 8 BIT 8K FLASH 8-bit Microcontrollers - MCU 4KB Flash, 512 Ram 8-bit Microcontrollers - MCU 8BIT 8K FLASH
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
package instruction 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 ROHS COMPLIANT, MS-013AE, SOIC-28 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16 ROHS COMPLIANT, MS-013AE, SOIC-28 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 LQFP, QFP32,.35SQ,32 4 X 4 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-32
Reach Compliance Code unknown unknown compliant unknown unknown unknown compliant unknown
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 EAR99
Has ADC YES YES YES YES YES YES YES YES
bit size 8 8 8 8 8 8 8 8
maximum clock frequency 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz
DAC channel NO NO NO NO NO NO NO NO
DMA channel NO NO NO NO NO NO NO NO
JESD-30 code S-PQFP-G32 R-PDSO-G28 R-PDSO-G16 R-PDSO-G16 R-PDSO-G28 S-PQFP-G32 S-PQFP-G32 S-XQCC-N32
length 7 mm 17.95 mm 5 mm 5 mm 17.925 mm 7 mm 7 mm 4 mm
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of I/O lines 28 24 14 14 24 28 28 28
Number of terminals 32 28 16 16 28 32 32 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code LQFP SOP TSSOP TSSOP SOP LQFP LQFP HVQCCN
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 1.6 mm 2.65 mm 1.2 mm 1.2 mm 2.65 mm 1.4 mm 1.6 mm 1 mm
speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD
Terminal pitch 0.8 mm 1.27 mm 0.65 mm 0.65 mm 1.27 mm 0.8 mm 0.8 mm 0.4 mm
Terminal location QUAD DUAL DUAL DUAL DUAL QUAD QUAD QUAD
Maximum time at peak reflow temperature 40 40 40 40 40 40 40 40
width 7 mm 7.5 mm 4.4 mm 4.4 mm 7.5 mm 7 mm 7 mm 4 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free - Lead free
Parts packaging code QFP SOIC - TSSOP SOIC QFP - QFN
Contacts 32 28 - 16 28 32 - 32
JESD-609 code e3 e3 e3 e3 e3 e3 e3 -
Encapsulate equivalent code QFP32,.35SQ,32 SOP28,.4 - TSSOP16,.25 SOP28,.4 QFP32,.35SQ,32 QFP32,.35SQ,32 LCC32,.16SQ,16
power supply 1.8/3.6 V 1.8/3.6 V - 1.8/3.6 V 1.8/3.6 V 1.8/3.6 V 1.8/3.6 V 1.8/3.6 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 512 - 256 256 512 256 512
rom(word) 4096 8192 - 4096 4096 8192 4096 8192
Nominal supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V -
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) -
Base Number Matches 1 1 1 1 1 - 1 -
Brand Name - - Freescale Freescale Freescale Freescale - Freescale

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