MC9S08QE8CFM datasheet, PDF - EEWORLD Datasheet

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MC9S08QE8CFM: Description8-bit Microcontrollers - MCU 8BIT 8K FLASH; CategoryThe embedded processor and controller Microcontrollers and processors; File Size966KB，54 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC9S08QE8CFM Overview

8-bit Microcontrollers - MCU 8BIT 8K FLASH

MC9S08QE8CFM Parametric

Parameter Name	Attribute value
Brand Name	Freescale
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFN
package instruction	4 X 4 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-32
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Has ADC	YES
Address bus width
bit size	8
CPU series	HCS08
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-XQCC-N32
length	4 mm
Humidity sensitivity level	3
Number of I/O lines	28
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC32,.16SQ,16
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	1.8/3.6 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	8192
ROM programmability	FLASH
Maximum seat height	1 mm
speed	20 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	4 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	4 X 4 MM, 1 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-32	ROHS COMPLIANT, MS-013AE, SOIC-28	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16	ROHS COMPLIANT, MS-013AE, SOIC-28	7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32	LQFP, QFP32,.35SQ,32	7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32
Reach Compliance Code	unknown	unknown	compliant	unknown	unknown	unknown	compliant	unknown
ECCN code	EAR99	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	YES	YES	YES	YES	YES	YES	YES	YES
bit size	8	8	8	8	8	8	8	8
maximum clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	S-XQCC-N32	R-PDSO-G28	R-PDSO-G16	R-PDSO-G16	R-PDSO-G28	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32
length	4 mm	17.95 mm	5 mm	5 mm	17.925 mm	7 mm	7 mm	7 mm
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of I/O lines	28	24	14	14	24	28	28	28
Number of terminals	32	28	16	16	28	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	SOP	TSSOP	TSSOP	SOP	LQFP	LQFP	LQFP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1 mm	2.65 mm	1.2 mm	1.2 mm	2.65 mm	1.4 mm	1.6 mm	1.6 mm
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.4 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40
width	4 mm	7.5 mm	4.4 mm	4.4 mm	7.5 mm	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Brand Name	Freescale	-	Freescale	Freescale	Freescale	Freescale	-	-
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	-	Lead free
Parts packaging code	QFN	SOIC	-	TSSOP	SOIC	QFP	-	QFP
Contacts	32	28	-	16	28	32	-	32
Encapsulate equivalent code	LCC32,.16SQ,16	SOP28,.4	-	TSSOP16,.25	SOP28,.4	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32
power supply	1.8/3.6 V	1.8/3.6 V	-	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V	1.8/3.6 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	512	512	-	256	256	512	256	256
rom(word)	8192	8192	-	4096	4096	8192	4096	4096
JESD-609 code	-	e3	e3	e3	e3	e3	e3	e3
Nominal supply voltage	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Terminal surface	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Base Number Matches	-	1	1	1	1	-	1	1

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