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EDI8G321024V17MNC

Description
SRAM Module, 1MX32, 17ns, CMOS,
Categorystorage    storage   
File Size148KB,6 Pages
ManufacturerEDI [Electronic devices inc.]
Download Datasheet Parametric Compare View All

EDI8G321024V17MNC Overview

SRAM Module, 1MX32, 17ns, CMOS,

EDI8G321024V17MNC Parametric

Parameter NameAttribute value
MakerEDI [Electronic devices inc.]
Reach Compliance Codeunknown
Maximum access time17 ns
Other featuresTTL COMPATIBLE INPUT OUTPUT
I/O typeCOMMON
JESD-30 codeR-XSMA-N72
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals72
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.08 A
Minimum standby current3 V
Maximum slew rate1.28 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
Base Number Matches1

EDI8G321024V17MNC Related Products

EDI8G321024V17MNC EDI8G321024V15MNC EDI8G321024V15MZC EDI8G321024V17MZC EDI8G321024V17MMC EDI8G321024V12MNC EDI8G321024V15MMC EDI8G321024V20MMC EDI8G321024V20MNC EDI8G321024V20MZC
Description SRAM Module, 1MX32, 17ns, CMOS, SRAM Module, 1MX32, 15ns, CMOS, SRAM Module, 1MX32, 15ns, CMOS, SRAM Module, 1MX32, 17ns, CMOS, SRAM Module, 1MX32, 17ns, CMOS, SRAM Module, 1MX32, 12ns, CMOS, SRAM Module, 1MX32, 15ns, CMOS, SRAM Module, 1MX32, 20ns, CMOS, SRAM Module, 1MX32, 20ns, CMOS, SRAM Module, 1MX32, 20ns, CMOS,
Maker EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.]
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 17 ns 15 ns 15 ns 17 ns 17 ns 12 ns 15 ns 20 ns 20 ns 20 ns
Other features TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT TTL COMPATIBLE INPUT OUTPUT
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XSMA-N72 R-XSMA-N72 R-XZMA-T72 R-XZMA-T72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XZMA-T72
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72 72 72 72 72
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code SIMM SIMM ZIP ZIP SIMM SIMM SIMM SIMM SIMM ZIP
Encapsulate equivalent code SSIM72 SSIM72 ZIP72/76,.1,.1 ZIP72/76,.1,.1 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 ZIP72/76,.1,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A 0.08 A
Minimum standby current 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Maximum slew rate 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA 1.28 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE ZIG-ZAG ZIG-ZAG SINGLE SINGLE SINGLE SINGLE SINGLE ZIG-ZAG
Base Number Matches 1 1 1 1 1 1 1 1 - -

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