SRAM Module, 1MX32, 15ns, CMOS,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | EDI [Electronic devices inc.] |
Reach Compliance Code | unknown |
Maximum access time | 15 ns |
Other features | TTL COMPATIBLE INPUT OUTPUT |
I/O type | COMMON |
JESD-30 code | R-XZMA-T72 |
JESD-609 code | e0 |
memory density | 33554432 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 72 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX32 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | ZIP |
Encapsulate equivalent code | ZIP72/76,.1,.1 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.08 A |
Minimum standby current | 3 V |
Maximum slew rate | 1.28 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |
EDI8G321024V15MZC | EDI8G321024V15MNC | EDI8G321024V17MZC | EDI8G321024V17MMC | EDI8G321024V12MNC | EDI8G321024V15MMC | EDI8G321024V20MMC | EDI8G321024V17MNC | EDI8G321024V20MNC | EDI8G321024V20MZC | |
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Description | SRAM Module, 1MX32, 15ns, CMOS, | SRAM Module, 1MX32, 15ns, CMOS, | SRAM Module, 1MX32, 17ns, CMOS, | SRAM Module, 1MX32, 17ns, CMOS, | SRAM Module, 1MX32, 12ns, CMOS, | SRAM Module, 1MX32, 15ns, CMOS, | SRAM Module, 1MX32, 20ns, CMOS, | SRAM Module, 1MX32, 17ns, CMOS, | SRAM Module, 1MX32, 20ns, CMOS, | SRAM Module, 1MX32, 20ns, CMOS, |
Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 15 ns | 15 ns | 17 ns | 17 ns | 12 ns | 15 ns | 20 ns | 17 ns | 20 ns | 20 ns |
Other features | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT | TTL COMPATIBLE INPUT OUTPUT |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XZMA-T72 | R-XSMA-N72 | R-XZMA-T72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XZMA-T72 |
memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | ZIP | SIMM | ZIP | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | ZIP |
Encapsulate equivalent code | ZIP72/76,.1,.1 | SSIM72 | ZIP72/76,.1,.1 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | ZIP72/76,.1,.1 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A |
Minimum standby current | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Maximum slew rate | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.28 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | ZIG-ZAG | SINGLE | ZIG-ZAG | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | ZIG-ZAG |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |