EDI8G321024V20MZC datasheet, PDF

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EDI8G321024V20MZC: DescriptionSRAM Module, 1MX32, 20ns, CMOS,; Categorystorage storage; File Size148KB，6 Pages; ManufacturerEDI [Electronic devices inc.]

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EDI8G321024V20MZC Overview

SRAM Module, 1MX32, 20ns, CMOS,

EDI8G321024V20MZC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	EDI [Electronic devices inc.]
Reach Compliance Code	unknown
Maximum access time	20 ns
Other features	TTL COMPATIBLE INPUT OUTPUT
I/O type	COMMON
JESD-30 code	R-XZMA-T72
JESD-609 code	e0
memory density	33554432 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	72
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	ZIP
Encapsulate equivalent code	ZIP72/76,.1,.1
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.08 A
Minimum standby current	3 V
Maximum slew rate	1.28 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

EDI8G321024V20MZC Related Products

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Description	SRAM Module, 1MX32, 20ns, CMOS,	SRAM Module, 1MX32, 15ns, CMOS,	SRAM Module, 1MX32, 15ns, CMOS,	SRAM Module, 1MX32, 17ns, CMOS,	SRAM Module, 1MX32, 17ns, CMOS,	SRAM Module, 1MX32, 12ns, CMOS,	SRAM Module, 1MX32, 15ns, CMOS,	SRAM Module, 1MX32, 20ns, CMOS,	SRAM Module, 1MX32, 17ns, CMOS,	SRAM Module, 1MX32, 20ns, CMOS,
Maker	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	20 ns	15 ns	15 ns	17 ns	17 ns	12 ns	15 ns	20 ns	17 ns	20 ns
Other features	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT	TTL COMPATIBLE INPUT OUTPUT
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XZMA-T72	R-XSMA-N72	R-XZMA-T72	R-XZMA-T72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72	R-XSMA-N72
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	72	72	72	72	72	72	72	72	72	72
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	ZIP	SIMM	ZIP	ZIP	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM
Encapsulate equivalent code	ZIP72/76,.1,.1	SSIM72	ZIP72/76,.1,.1	ZIP72/76,.1,.1	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A	0.08 A
Minimum standby current	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Maximum slew rate	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	SINGLE	ZIG-ZAG	ZIG-ZAG	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Base Number Matches	-	1	1	1	1	1	1	1	1	-

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