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D2186A-35

Description
DRAM, 8KX8, 350ns, MOS, CDIP28
Categorystorage    storage   
File Size60KB,1 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

D2186A-35 Overview

DRAM, 8KX8, 350ns, MOS, CDIP28

D2186A-35 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
package instructionDIP, DIP28,.6
Reach Compliance Codeunknown
Maximum access time350 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T28
JESD-609 codee0
memory density65536 bit
memory width8
Number of terminals28
word count8192 words
character code8000
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

D2186A-35 Related Products

D2186A-35 5962-01-237-7394 D2186A-30 D2186A-25 D2186-35S7572 D2186-30S7572 D2186-25S7572
Description DRAM, 8KX8, 350ns, MOS, CDIP28 DRAM, 8KX8, 250ns, MOS, CDIP28, DRAM, 8KX8, 300ns, MOS, CDIP28 DRAM, 8KX8, 250ns, MOS, CDIP28 DRAM, 8KX8, 350ns, MOS, CDIP28 DRAM, 8KX8, 300ns, MOS, CDIP28 DRAM, 8KX8, 250ns, MOS, CDIP28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknown compli unknown unknown unknown unknown unknown
Maximum access time 350 ns 250 ns 300 ns 250 ns 350 ns 300 ns 250 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28
memory density 65536 bit 65536 bi 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
memory width 8 8 8 8 8 8 8
Number of terminals 28 28 28 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000 8000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO
technology MOS MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker Intel - Intel Intel - Intel Intel
JESD-609 code e0 - e0 e0 e0 e0 e0
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Base Number Matches 1 1 1 1 1 - -
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