DRAM, 8KX8, 350ns, MOS, CDIP28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Intel |
package instruction | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
Maximum access time | 350 ns |
I/O type | COMMON |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
memory density | 65536 bit |
memory width | 8 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | MOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
D2186A-35 | 5962-01-237-7394 | D2186A-30 | D2186A-25 | D2186-35S7572 | D2186-30S7572 | D2186-25S7572 | |
---|---|---|---|---|---|---|---|
Description | DRAM, 8KX8, 350ns, MOS, CDIP28 | DRAM, 8KX8, 250ns, MOS, CDIP28, | DRAM, 8KX8, 300ns, MOS, CDIP28 | DRAM, 8KX8, 250ns, MOS, CDIP28 | DRAM, 8KX8, 350ns, MOS, CDIP28 | DRAM, 8KX8, 300ns, MOS, CDIP28 | DRAM, 8KX8, 250ns, MOS, CDIP28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
Reach Compliance Code | unknown | compli | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 350 ns | 250 ns | 300 ns | 250 ns | 350 ns | 300 ns | 250 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
memory density | 65536 bit | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO | NO | NO | NO | NO |
technology | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Intel | - | Intel | Intel | - | Intel | Intel |
JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |