D2186-30S7572 datasheet, PDF - EEWORLD Datasheet

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D2186-30S7572: DescriptionDRAM, 8KX8, 300ns, MOS, CDIP28; Categorystorage storage; File Size60KB，1 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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D2186-30S7572 Overview

DRAM, 8KX8, 300ns, MOS, CDIP28

D2186-30S7572 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Maximum access time	300 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
memory density	65536 bit
memory width	8
Number of terminals	28
word count	8192 words
character code	8000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

D2186-30S7572 Related Products

	D2186-30S7572	5962-01-237-7394	D2186A-30	D2186A-35	D2186A-25	D2186-35S7572	D2186-25S7572
Description	DRAM, 8KX8, 300ns, MOS, CDIP28	DRAM, 8KX8, 250ns, MOS, CDIP28,	DRAM, 8KX8, 300ns, MOS, CDIP28	DRAM, 8KX8, 350ns, MOS, CDIP28	DRAM, 8KX8, 250ns, MOS, CDIP28	DRAM, 8KX8, 350ns, MOS, CDIP28	DRAM, 8KX8, 250ns, MOS, CDIP28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Reach Compliance Code	unknown	compli	unknown	unknown	unknown	unknown	unknown
Maximum access time	300 ns	250 ns	300 ns	350 ns	250 ns	350 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28
memory density	65536 bit	65536 bi	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
memory width	8	8	8	8	8	8	8
Number of terminals	28	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Intel	-	Intel	Intel	Intel	-	Intel
JESD-609 code	e0	-	e0	e0	e0	e0	e0
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Base Number Matches	-	1	1	1	1	1	-

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