3DA752G(TO-252-2L) datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> The transistor> 3DA752G(TO-252-2L)

3DA752G(TO-252-2L): DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size81KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

3DA752G(TO-252-2L) Overview

Transistor

3DA752G(TO-252-2L) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknown
Base Number Matches	1

3DA752G(TO-252-2L) Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-251/TO-252-2L Plastic-Encapsulate Transistors

3DA752

FEATURES

Power dissipation

TRANSISTOR (NPN)

TO-251

TO-252-2L

123

1.BASE

MAXIMUM RATINGS (T

=25

℃

unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector power dissipation

Junction Temperature

Storage Temperature

Value

1.2

150

-55-150

Units

℃

2.COLLECTOR

3.EMITTER

ELECTRICAL CHARACTERISTICS (Tamb=25

℃

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat)1

Collector-emitter saturation voltage

CE(sat)2

Transition frequency

Collector output capacitance

unless otherwise specified)

conditions

MIN

0.1

100

400

0.8

120

MHz

TYP

MAX

UNIT

µA

Test

=100µA,I

=10mA,I

=1mA,I

=40V,I

=5V,I

=2V,I

=500mA

=2A,I

=0.2A

=1.5A,I

=30mA

=5V,I

=500mA

=10V,I

=0,f=1MHz

CLASSIFICATION OF

Rank

Range

Marking

100-200

160-320

200-400

Recommended Resources

79-A type automatic AC regulated power supply circuit

Circuit to expand output current

Stepping 1V voltage regulator circuit

555 oscilloscope additional two-way display switch circuit

LED slow charging circuit

UWB ultra-wideband positioning principle and application: Last September, at Apple’s new product launch conference, the news that all iPhone 11s will be equipped with UWB ultra-wideband chips brought UWB back into the public eye. So, what kind of technology ...; 火辣西米秀 RF/Wirelessly

Understanding of several layers in drawing PCB: When using the IPC footprint wizard wizard that comes with AD2018 to generate a TSSOP package, you will go through the following step, which is to set the mechanical layerFigure 1. In Figure 1, the 15...; shaorc PCB Design

How to use logic analyzer to debug SPI anomalies: As the title says, I recently used a logic analyzer (a pretty cheap one, but it doesn’t make sense that low-speed SPI would have problems, right?) to monitor the SPI communication between STM32F103C8T...; 癸锋 MCU

TI C6000 CodecEngine integrated algorithm core calling principle: [i=s]This post was last edited by Baboerben on 2019-12-15 21:07[/i]The C6000 series DAVINCI is a dual-core: ARM+DSP or ARM+DSP+other GPP architecture. The proprietary algorithm can be integrated into ...; 灞波儿奔 Microcontroller MCU

Commonly used techniques in PCB design: Commonly used techniques in PCB design In the current mainstream market, the most commonly used circuit diagram drawing and plate making software are AD and CADENCE. After drawing the schematic diagra...; 一个小白5 PCB Design

[Silicon Labs Development Kit Review] Using TensorFlow to Prototype Gesture Recognition Project: [i=s]This post was last edited by Beifang on 2021-9-10 16:41[/i]1. First, you need to cite the source of the information https://github.com/arduino/ArduinoTensorFlowLiteTutorials/ This is the guide fo...; 北方 Development Kits Review Area

Popular Components