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PCB impedance design [Copy link]


1. Thickness values (mil) of three commonly used prepregs under different conditions.
Copper represents the TOP and BOTTOM layers, gnd represents the power supply or ground layer, and signal represents the signal layer. Dielectric Thickness
0.5Oz
Copper/Gnd Gnd/Gnd Copper/Signal GND/signal Signal/Signal
1080 2.8 2.6 2.5 2.4 2.2
2116 4.6 4.4 4.2 4.0 3.8
7628 7.3 7.0 6.8 6.7 6.6 Dielectric Thickness 1Oz Copper/Gnd Gnd/Gnd Copper/Signal GND/signal Signal/Signal 1080 2.8 2.6 2.5 2.4 2.2 2116 4.5 4.3 4.1 3.9 3.7 7628 7.1 6.8 6.6 6.5 6.4 2. Core board thickness comparison table (two decimal places represent dielectric thickness, one decimal place includes copper foil thickness): Core board (nominal value) 0.13 0.21 0.25 0.36 0.51 0.71 \ Imperial (mil) 5 8 10 14 20 28 \ Core board (nominal value) 1.0 1.2 1.6 2.0 2.4 2.5 0.8 Imperial (mil) 38.98 45.28 61.02 76.77 92.52 96.46 31.5 3. Copper thickness parameter comparison table: Nominal base copper specification (um) 18 35 70 Inner layer calculated copper thickness (mil) 0.6 1.2 2.6 Outer layer calculated copper thickness (mil) 1.9 2.56 3.94   4. Line trapezoidal cross-section parameter comparison table: Layer/line width Base copper thickness (um) Upper line width (mil) (W) Lower line width (mil) (W1) Inner layer 18 W1-0.5 W1 35 W1-1 W1 Outer layer 18 W1-1 W1 35 W1-0.8 W1-0.5   (Note: W1 = customer designed line width) 5. Dielectric constant of prepreg combination 1080---4.3 2116---4.5 7628---4.7 The dielectric constant of the prepreg combination is the arithmetic mean of each prepreg, for example: 1080+2116---(4.3+4.5)/2 7628+2116---(4.5+4.7)/2










 



















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Wouldn't it be possible to solve everything by using software? Is it necessary to do this?   Details Published on 2006-11-13 23:46
 

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My design is just what you need, thank you!
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I don't understand
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It would be better if you can combine it with an example
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Wouldn't it be possible to solve everything by using software? Is it necessary to do this?
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