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How much current can be increased by tinning on PCB copper foil? [Copy link]

If so, how much current can be increased by opening a window on the copper foil and piling up solder paste like the following? What is the effect?

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The actual current carrying capacity depends on the allowable temperature rise range of the PCB, the load type, and the heat dissipation conditions.  Details Published on 2024-10-10 13:31
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Visual inspection: 20A or above
 
 
 

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It's no problem to increase it 10 times

How thick should the copper foil be? If it is too thick, it will generate too much heat.

Too thick may not be uniform, resulting in increased resistance

 
 
 

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  • Limited improvement in current-carrying capacity : The direct improvement of tinning on the current-carrying capacity of copper foil is very limited.
  • Improve long-term stability : The tin layer can provide a certain degree of protection, reduce oxidation and corrosion of the copper foil, and thus extend the service life of the circuit board.
 
 
 

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The same area of copper foil can easily carry 3-5 times the current, and can be even higher in a short time.

It is recommended that the gaps of the dotted lines should not be aligned, otherwise thermal expansion and contraction will reduce the life of the PCB. Cross-radiated tin pads should be used, including circular solder joints.

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About 8A. And when it gets hot, you need to see the impedance change.
 
 
 

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The actual current carrying capacity depends on the allowable temperature rise range of the PCB, the load type, and the heat dissipation conditions.
 
 
 

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