The second article of reading notes on "The Great Chip"
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This reading review mainly shares the content of the second part of the book, including chapters 3, 4 and 5. These chapters mainly start from the design of the chip, and introduce the chip design and manufacturing process, the CPU architecture and basic principles, and the chip testing and packaging. Through reading, I learned that the design of any chip must start with market research, and then every link is indispensable to delivery and manufacturing. Market research is to obtain the necessary information required for the product, so as to meet the needs of power consumption, performance and other aspects. Among them, EDA, as a very important part of chip design, greatly improves the work efficiency of chip design engineers.
Generally speaking, the chip manufacturing process is mainly divided into the following steps: manufacturing silicon wafers - thin film deposition - photolithography - etching - metrology and detection - ion implantation - interconnection - post-processing and test packaging. Each step here is closely linked and not easy. As the core equipment of the photolithography process in the chip manufacturing process: the photolithography machine, it determines the size of the chip and also determines about 35% of the cost of the entire chip manufacturing. Therefore, this technology is very important. There are very few semiconductor companies in the world that can produce photolithography machines, such as ASML, which can produce EUV. Since the West started earlier in the field of photolithography machines and invested more, while we started later, there is still a certain gap with them.
Regarding chip packaging and testing, the electrical parameters of the wafer will be tested before leaving the factory, which we call WAT. These are usually the last two processes before the chip leaves the factory. After packaging and testing, qualified chips will be put on the market. Therefore, the main purpose of testing is to screen out defective chips. At present, the basic testing of chips is mainly divided into four categories: DC parameter testing, digital function testing, built-in self-test, and analog-digital mixed testing. These tests are usually performed on automatic detection equipment, which is another technology related to chips.
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