Based in Chengdu, recruitment position: mid-level or senior hardware engineer

mgstanley

Based in Chengdu, recruitment position: mid-level or senior hardware engineer [Copy link]

Recruitment position : Intermediate or senior hardware engineer ;

Job Description:

1. Complete the design of electrical subsystem according to product requirements and system solutions;

2. Design circuit schematics and PCB according to hardware solutions ;

3. Responsible for component selection , establishing complete design technical documentation for product circuit systems, and maintaining or assisting in the management of developed hardware products;

4. Responsible for formulating board making and welding technical requirements, and connecting PCB board making and PCBA welding;

5. Develop detailed test plans and test plans, write test reports, and complete test analysis and summary;

6. Develop necessary FPGA programs or ARM embedded programs as needed;

7. Cooperate to complete product conversion and provide necessary technical support for mass-produced products;

8. Complete other tasks assigned by department and project leaders.

Qualifications:

1. Bachelor degree or above in electrical automation, electronic engineering, communications and computer related majors , more than 3 years of experience in circuit development;

2. Familiar with analog and digital circuit design, proficient in using circuit design software such as Cadence or Altium Designer , familiar with analog and digital circuit simulation tools such as SPICE and Multisim , and have relevant professional knowledge;

3. Have relevant knowledge of signal integrity, be familiar with circuit board stacking structure and processing technology, and be familiar with transmission line principles, equal-length lines, differential lines, and impedance matching;

4. Be proficient in using common testing equipment: multimeter, oscilloscope, signal generator, etc., and be familiar with the selection of common electronic components and supplier management;

5. Candidates with FPGA development experience or ARM embedded development experience are preferred;

6. Good hardware production ability, proficient in using office software for document writing;

7. Be proactive, with good communication, coordination and teamwork skills.

Recruiter: The company focuses onhigh-performanceX-ray imaging detectors, and has planned to deploy other solid-state imaging detector products.
Contact information: If interested, please call 131##4277@@4957, or +V: mgstanley.

li6246583111

The team has 3 senior engineers.

Mr. Zhang: Majoring in communication engineering, he has 18 years of R&D experience in Shenzhen, and has been engaged in PCBA (board) R&D. He is good at C++, JAVA, and assembly language development. He has written MCU development, wireless communication protocol stack, embedded system, LINUX driver, and Android system (SOC). He is proficient in IIC, I2S, SPI, UART, RS232, RS485, SDIO, HDMI (1.0-2.0), USB (2.0-3.0), camera driver and other protocols.

Mr. Xiong (senior hardware engineer): Majoring in electronic technology application, he has 23 years of R&D experience in Shenzhen, and has been engaged in PCBA (board) R&D. He has served as R&D manager, R&D director, and R&D vice president. He is good at helping customers improve product stability and solve difficult problems in product development. He has been hired as a technical consultant for two large companies. He is proficient in hardware schematics and PCB design, and his design tools include Altium Designer, PADS, Allegro, etc. The product range that has been successfully developed: consumer audio and video R&D and professional audio R&D, industrial control, driving recorder, automotive aftermarket, electronic dog, knockoff mobile phone, radio module, Bluetooth module, 4G module, camera module, fingerprint lock, robot, drone, ARM, FPGA, Android system (SOC), AI products (smart home).

Li Gong: majoring in electronic information, good at hardware circuit and PCB design, proficient in circuit board design tools such as Altium Designer, PADS, Allegro, good at the design of 4-layer, 8-layer and 16-layer multi-layer boards, rich experience in EMC, EMD, and rich experience in RF radio frequency routing. The product range that has been successfully developed: consumer audio and video R&D, Bluetooth module, camera module, 4G module, fingerprint lock, drone, ARM, FPGA, Android system (SOC), AI products (smart home).

Contact: Zhang Jianfu Tel: 13530263669. QQ: 289534181.